SP50 for 3-D solder paste inspection features full volume, height, area and registration measurements. Speeds reportedly up to 38.7cm²/sec. Handles boards up to 19.5 x 19.5”. Features Agilent head swap technology, which permits alternating equipment from an SP50 to an SJ50. Has optical encoders and linear motors. speeds may vary depending upon application. Has scalable 6 μm per pixel resolution and 4 μm height resolution.

Agilent Technologies, www.agilent.com

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