VPS Condenso Vacuum condensation reflow system is said to minimize void rates by subjecting the molten solder to a vacuum, removing residues and gas inclusions that would otherwise result in voids in the solidified joint. Reportedly can produce solder joints with surface contact ratios of greater than 99%. Releases even heat during condensation and maintains constant temperature. Limits maximum soldering temperatures so PCBs do not sustain damage from overheat.
Rehm Thermal Systems, www.rehm-group.com
