T200A is a batch-type Pb-free reflow oven for low volumes and limited floor space. Is said to be capable of attaining Pb-free temperatures to 300ºC; offers a ∆T performance envelope of ±1 ºC across a 360 mm x 230 mm processing area. Uses a mix of quartz IR and hot air convection. Solders chips and other SM devices in accordance with recommended profiles. Generates and stores 20 to 40 sequential time and temperature settings. Can be used for curing and drying.
 
Manncorp, www.manncorp.com
 

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