MYPlan v. 4.1 includes a Job Sequence Optimizer. Calculates the best production sequence and changeover strategy for any mix of products and batch sizes. Eliminates unnecessary feeder movements. Automatically calculates an optimized job sequence, using an optimization algorithm that takes both machine speed and feeder loading effort into account. Suitable jobs run together based on part commonality; are placed in family kits. Other jobs will be run separately, with different changeover strategies depending on batch size and priority, including prototypes, large batches, and variants. Is fully integrated with the material handling system MYLabel and the automated storage solution SMD Tower. Provides full visibility of material status and availability.

Mydata Automation, www.mydata.com

TR7007 3D SPI has a reported throughput of 171cm²/sec. at 14 µm resolution and 87cm²/sec. at 10 µm. Implements a fringe pattern technology and a dual lighting system that eliminates shadows and provides defect detection. Uses a linear motor.

Test Research Inc., www.tri.com.tw

IPC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes, presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling; now provides additional codes for more precise specification of certain Pb-free solders.  Provides guidance on marking and labeling of components and PCBs using a range of solder alloys. Enables clear identification of assemblies with lead or Pb-free solder; components that have lead or Pb-free second-level interconnect terminal finishes and materials; base materials used in PCB construction, including halogen-free resin; surface finishes, and conformal coatings. Prescribes maximum component temperature for assembly and rework.

IPC, www.IPC.org

A-Series pick-and-place machine reportedly now places ICs at the same speed and accuracy as chip components using the Twin Placement Robot. TPR eliminates need for extra line balancers; is ideal for DRAM placement. Reportedly places up to 111,000 cph, at accuracy of up to 35 µm. Picks components from front side tape and tray feeder. Has below 10 defects per million.

Assembléon, www.assembleon.com