Circuits Assembly Online Magazine - New Products

New Products

IG series micrometer technology is for edge guiding of opaque, transparent or translucent materials, position control, outer diameter measurement, and gap control. The control system includes numerous built-in, application-specific operation modes, enabling most installations to be configured and operational within seconds. Has a small footprint. Optical axis alignment is quickly accomplished. Fast alignment and setup is simplified with the highly visible beam and an LED bar monitor position display built into the sensor head. Uses a high-precision L-CCD to determine the edge positions of any target placed within the sensor’s beam. Includes several error extraction algorithms and an I-DSP.

Keyence, www.keyence.com/PRIG

ProFlow ATx enclosed head printing technology can accommodate all solder pastes. Combines a low-volume print chamber with a paste loading mechanism. Actively conditions solder paste materials; delivers a paste roll for precise aperture filling. Has direct, automatic loading from packaging. Reportedly meets criteria of first pass yield of better than 98% and scrap of less than 0.5%.

DEK, www.dek.com

Q Series 600 mL cartridges have leak-free mixer connections and standard side-by-side outlets. Are currently available in 600 mL, 1:1 ratio cartridges. Are easy to open and close; fit common industry dispensers; are pressure-tested and sturdy. Are available in polypropylene or nylon. Have an optional flow restrictor for low viscosity materials.

Sulzer Mixpac USA Inc., www.sulzermixpacusa.com

Multicore LF620 is a no-clean, halide-free, Pb-free solder paste that has a broad process window for printing, reflow and humidity resistance. Has a consistent print performance with minimal hot slump, even with temperatures of 86°F or more and relative humidity of 80%. Exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes, including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Has good printability at low or high speeds. Is well suited for the automotive sector. Delivers a high tack force for component stability during high-speed placement, an abandon time of four hours and a print work-life of up to 24 hours.

Henkel, www.henkel.com/electronics

The IS-450 selective soldering machine automatically solders through-hole components onto mixed technology PCBs using an under-board mini-wave; solders connectors, capacitors and high-power devices onto boards at Pb-free process temperatures of 250º to 330ºC. Conducts dip-and-drag selective soldering for post-reflow, through-hole components and odd forms. Is powered by closed-loop servo motors for X, Y & Z axis motion that articulate the fluxer and mini-wave. Maintains adjustable clearance of as little as 1.5 mm. Reportedly solders from 3X to 8X more quickly, and with higher accuracy, than hand soldering. Is programmable off-line to govern wave temperature and height, travel speed and dwell time at each point.

Manncorp, www.manncorp.com

Vectra G Series includes two halogen-free liquid crystal polymer grades with processing characteristics that avoid issues commonly encountered when using flame-retardant, high temperature nylons to mold components. Vectra G131 and G331 are LCPs designed to help meet Pb-free soldering and halogen-free requirements. Vectra G131 is 35% glass-filled; Vectra G331 is 35% mineral- and glass-filled. Both are flame resistant without additives; V-0 to 0.15 mm; potential drop-in solutions for small FR, HT nylon parts. Said to achieve dimensional stability in thin-wall parts at more than 260°C. Processing advantages reportedly include fast molding cycle; no flash and mold deposit; Pb-free reflow capable; no moisture-related blister issues; longer tool life (noncorrosive in water-heated molds).

Ticona Engineering Polymers, www.ticona.com