New Products
CB-400 COBRA-4 features a dual-head blue and white light LED flashlight, which enables leak checking and internal component inspection into hard-to-reach areas. Blue-light LED is for fluorescent leak detection, while the white-light LED is for component inspection. Press-fit coupler permits quick and easy attachment of the flashlight to the borescope. Includes clip-on, angled inspection mirror for detecting flaws normally hidden from view.
Spectronics, www.spectroline.com
Cion ICT Adapter is a relay card for integration into fixture adapter systems for ICT. Enables switching of 32 test channels from the ICT to Scanflex. Prohibits a collision of both systems’ signals; minimizes dynamic effects because of multiple wiring at critical nets. Two LEDs indicate 5 V supply and activation state. Is available in different assembly variants: Relay Adapter SL is equipped with pin contact strips and suits bird nest wiring by wire wrap into adapter systems, as well as wiring a 50-pin ribbon cable, as used in DIO plug modules; Relay Adapter BU and Relay Adapter BU90 are single-sided, equipped with connector strips; enable direct pluggable connection to Cion Modules such as FXT96 in both horizontal and vertical directions. Can be used with plug-in card transceivers. Boundary scan TAP signals are switched with relay adapter similar to TIC02/SR modules. Switching 32 PIP signals is possible with one card.
Goepel electronic, www.goepel.com
S3X-BF70M and 200N series wafer bumping pastes exhibit a high definition over time at elevated temperatures. S3X-BF70M series is for 250 μm bump sizes. Offers superior cleaning performance in a SAC 305 powder with a 20~38 μm diameter. S3X-BF200M is for 100 μm bump sizes with a SAC 305 powder and 5~20 μm diameter.
Ko-ki, www.ko-ki.co.jp
i-Cube series model YSH20 flip-chip placer features a high-rigidity frame and dual-mount heads; is fitted with a chip recognition system employing a high-res camera. Is compliant with a 12" wafer supply unit (optional). Is possible to achieve a mounting capability of 4,500 uph. Can handle a variety of chip types ranging in size from 0.3 to 18 mm. Two types of wafer ejectors come standard.
Yamaha Motor, www.yamaha-motor.com
Ledcheck VIII automatically tests color, wavelength and light intensity of LEDs on PCBs while under test on automatic test equipment. Each module can accommodate eight LEDs; modules can be cascaded for additional channels. Each channel measures the true color of the LED under test and provides an analog output to the test system proportional to the wavelength of the light detected from the LED. Using digital channel addressing, the channel selection is under control of the test system.
Everett Charles Technologies, www.ectinfo.com
MC-392, for high-mix assembly, has two heads and features a placement rate of 6,400 cph. Includes ball screw X-Y drive and closed-loop servo control with linear encoding for placement accuracy of 30 µm, 3 Sigma. Comes as inline configuration with up to 96 feeders or as standalone unit with space for 160 feeders. Cognex-based vision system offers on-the-fly alignment of any SMD from 0.4 x 0.2 mm (01005) to 16 x 14 mm, including CSPs and µBGAs. Vision cameras align components up to 150 x 100 mm, including large BGAs and QFPs to 0.3 mm lead pitch. Selectively checks solder paste printing and component placement accuracy.
Manncorp, www.manncorp.com/pick-and-place/mc392
