New Products
032 general purpose, no-clean, halogen-free flux-cored solder wire is said to reduces spatter compared with conventional cored wire.
WP616 zero-halogen, Pb-free, water-soluble solder paste is for nitrogen and air reflow applications.
ChipVORX and VarioTAP embedded board test technologies now support Intel Arria 10 SoC (system-on-chip).
Master Bond EP110F8-3 is a two-part epoxy for sealing, encapsulating, potting, and casting applications.
CA-188-1 low-temperature cure electrically conductive adhesive is for die attach and general circuit assembly applications.
S3088 SPI for solder paste inspection and S3088 ultra and S3088 ultra gold AOI now come in extended versions for long printed circuit boards, including LED boards, with lengths up to 2000mm.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin