SB6N58-HF350 halogen-free solder paste is for automotive, transportation, and other heavy-load usage applications.

Categorized as ROL0 per IPC J-STD-004B. Sn3.5Ag0.5Bi6.0In composition is said to retain same level of joint reliability, viscosity stability, and meltability as the conventional solder paste of the same alloy. Thermal cycling testing (-40ºC/150ºC) indicated no cracks at the joint using after 1,500 cycles. Shows stable viscosity, good wettability and meltability. Melting point is 217º-219ºC. Solder powder grain size is 20-38μm.


Register now for PCB West, the leading conference and exhibition for printed circuit board design! Coming Sept. 9-12 to the Santa Clara Convention Center.


Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article