New Products
TF Series BGA rework systems include TF1800, designed for standard board sizes of up to 12" x 12", and TF2800 for large, high-mass PCBs up to 24" x 24".
Smart Reflow Analyzer (SRA) is an integrated fixture and profiler designed to collect reflow oven-related data to analyze and track machine stability from run to run over time.
Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.
G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.
Smart reflow process inspection (RPI) data analytics have been integrated into iTAC.MES.Suite.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin