Circuits Assembly Online Magazine - Features

AlSiC (Aluminum Silicon Carbide) is a metal matrix composite suited for optoelectronic housings and lids.

Enables a tailored coefficient of thermal expansion, for compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities ensure alignment and precision.

Exhibits a high thermal conductivity that results in efficient thermal dissipation and prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

Near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and rapid prototyping. The un-restricted geometry enables inclusion of design features such as septums, walls and radial features. The casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

CPS Corp., www.alsic.com

Zestron America and QTS Inc., a stencil frame manufacturer, have successfully completed extensive compatibility tests. Under the direction of Zestron’s engineering team, newly developed QTS stencil frames were successfully tested with VIGON SC 200. The MPCtechnology removes raw solder paste and adhesive in a single process.

Tests were performed at one of a Technical Centers in accordance with Zestron’s Standard Stencil Compatibility Test Methods in ultrasonic and spray-in-air equipment. The frame structure and nylon composed buttons, for example, showed excellent compatibility with VIGON SC 200.

To obtain a copy of the compatibility certificate, contact ZESTRON America at (888) 999-9116 or QTS at (508) 359-7800.

A new version of Assembléon’s zero-defect set-up assistance software is said to simplify set-up of its SMD placement machines, particularly in applications where the production line is configured to process a multiplicity of smaller production batches.

Two new features are available for SVS-Pro supported machines and the feeder Loading Unit. For board family set-up, the production preparation software uses ‘dummy’ feeders so that the set-up is identical during optimization of the various process programs of the family. The use of dummy feeders implies that in the set-up of a particular process program a part number is defined but is not present, although it may be present in the process program of another board in the family. SVS-Pro 3.1 allows two different modes of operation.

In the stricter mode of operation, it checks all feeders in a process program, including those for which no mountline exists (dummies). If a feeder is not present, the software will not allow production to proceed even if the related part number is not used on the board. In a less strict mode, it does not check the dummy feeders and does not generate an error, but allows production to start.

Placement machines and the Loading Unit can now read multiple composite barcodes and format string for quantity barcodes in combination with non-leaded barcodes.

Improves operator guidance during feeder programming, showing which feeders are needed in the selected set-up.

For AX machines, provides automatic feeder pitch programming.

Offers multi-language support, including multi-byte languages, on the AX machines and the Loading Unit. Supported languages are English, German, Traditional Chinese and Simplified Chinese.

Assembléon, www.assembleon.com

Anderson Power Products has introduced the high density PowerMod connector family. The connector system, offered in three to 30 circuits, is available for straight PCB, right angle PCB, panel or cable mountings, offering design flexibility for system packaging.

Rated for 30 ampsm features mechanical polarized UL94V-O housings for proper circuit mating. Connectors have up to four sequential pin mating options available for mate-first/break-last and make-last/break-first circuits.

Offers stainless steel positive retention latches and optional back shells that provide additional safety and security. Available in 13 different sizes: single-row 3, 4, 6 and 8 circuit; two-row 6, 8, 12 and 16 circuit; and third row 9, 12, 18, 24 and 30 circuit connectors. UL- and TÜV- recognized, CSA certified.

Anderson Power Products, andersonpower.com

The Electronic Industries Alliance (EIA), the Japan Green Procurement Survey Standardization Initiative (JGPSSI) and JEDEC have published the first international standard for product material content reporting. The Joint Industry Guide for Material Composition Declaration for Electronic Products will harmonize the disclosure of material content data across the electronics supply chain.

Developed by EIA and JGPSSI, and standardized using JEDEC procedures, the standard was motivated by the trend toward international environmental regulations that restrict the use of certain substances. The most well-known of these regulations is the EU’s RoHS Directive, which will take effect in 2006, and will ban the use of specific materials that have traditionally been used in electronics manufacture.

The Guide provides a standardized list of materials that must be disclosed when present in products and subparts that are supplied to electrical and electronic equipment manufacturers for incorporation into their products. The list will benefit suppliers and their commercial customers by providing consistency and efficiency in the material declaration process. It will also encourage the development of consistent data exchange formats and tools to facilitate data transfer along the global supply chain.

Issues covered include:

Targeted lists of materials and substances for disclosure;

The composition amount or "threshold level" that requires disclosure for particular materials and substances;

Regulatory requirements that establish threshold levels, where appropriate;

Data fields for information exchange.

Available free of charge at www.eia.org/jig.

Flex Arm adds a new dimension of flexibility – in virtually every direction - with its 19” vertical post. Designed for mounting microscopes, vision systems, etc., is flexible, sturdy and stable. Allows vertical movement along the post (z-axis) as well as Theta (rotational), in addition to other lockable/positionable axes of movement.

Two versions available, equipped with a standard table clamp or a weighted base. Both are bench friendly, and do not require users to keep the horizontal arm at table height. Lower arm can be placed as high as 19” off the table, allowing users to work around existing bench top products or structures. The second (upper) adjustable arm can pivot and be adjusted at any number of angles for flexibility and clearance of benchtop objects.

The O.C. White Company, www.ocwhite.com