Checker trial software can be downloaded with the latest Checker version 1.3 release (cognex.com/checker).
The simple-to-use, inexpensive sensor can detect the presence of parts and part features, and recognize patterns. Eliminates the wiring and mounting complexity of multiple photoelectric sensors. Does not require precise part fixturing or positioning. All-in-one, IP67 design is suitable for industrial environments. Power up the unit, connect the USB cable to a PC and follow a simple setup procedure to be up and running in minutes.
In addition to the trial software, the latest release now allows for offline setup. It can also switch between 16 different sensor setups on the fly for automatic line changeovers. “Train and Go” capability lets the sensor learn new features to detect without having to connect to a PC. Now works on very large parts.
Cognex Corp., cognex.com
SHIRLEY, MA ¾ VJ Electronix will introduce VJE X2500, a fully automated x-ray inspection system compatible with lead-free solder in booth 9620 at Semicon West in July.
Said to provide high-contrast resolution at higher viewing angles than other x-ray systems. Features integrated motion control and image measurement analysis.
Simple setup using the 1-2-GO interface allows users to characterize the entire process while allowing inspection from every angle. On-screen representation of boards for easy maneuvering and instant, accurate information.
VJ ElectroniX, vjelectronix.comNASHVILLE — Kyzen Corp. will introduce AQUANOX A4630 aqueous electronics cleaning material in booth 7350 at the Semicon West tradeshow in San Francisco.
Designed to clean lead-free materials while provide low cost of ownership, the sixth-generation product brings ambient temperatures, low concentrations and an MEA-free designed material.
Typically used in aqueous spray-in-air equipment at 10 to 20%, from ambient temperatures and without sump side additives. Said to provide brilliant joints, pass after pass, throughout an extended bath life.
Kyzen Corp., kyzen.com
Milara Inc. will showcase its STW-1 wafer printing system in booth 9821 at the Semicon West show July 12-14, in San Francisco.
SemiTouch Wafer Printer system offers wafer stencil printing and bumping in a single system. By pressing a single button, the system converts itself from a wafer bumper to stencil printer in seconds.
Incorporates a vision system with accuracies of 12 µm that yields capabilities of ultra-fine-pitch printing. Uses patented vibration squeegee technology, employs the same technology to accomplish ultra-fine pitch-printing (down to 70 µm) with 100% printing reliability (no missed apertures on wafers with excess of 25,000 per print) in conjunction with solder brick geometry.
Capable of printing 300 mm wafers. Environmentally friendly, uses less paste than standard systems and has less waste build-up.
Milara Inc., milarasmt.com
SUN VALLEY, CA— Creative Automation Co. will highlight its automated dispensing system, Champion 6809, in booth 7531 at SEMICON West.
The servo-driven dispensing system, designed for precision processes, features proprietary software, a GUI for intuitive programming and control, and a large, bright, high-contrast color TFT display. Can be configured to match application requirements from dots to underfills with an array of options. Placement accuracy is within 3 mm.
Designed for nano dispensing, dispenses dot diameters down to 0.003" (75 mm) with bead width down to 0.003" (75 mm). Volumes are below 0.5 nanoliters (0.0000005 cc’s), and the pump is capable of firing up to 90,000 precision deposits per hour to form high-definition dots, lines, fills and builds. Volume repeatability is 1.7% at3 Sigma.Uses true positive displacement without augers and pump motors.
Comes standard with a three-axis brushless servo motor drive; x- and y-axis linear encoders, z-axis rotary encoding; powerful Windows-style software; LCD display; rugged construction and quiet operation; a small footprint; and a one-year warranty.
Creative Automation Co., creativedispensing.com
DES PLAINES, IL — Kester will highlight SE-CURE UT-10 TIM in booth 8802 at Semicon West.
The lead-free, SMT-compatible, high-performance thermal interface material consists of a paste containing both fusible and non-fusible metals in a 100%-solids, thermosetting polymer matrix. Can be dispensed or stencil-printed and is processable on standard lead-free SMT reflow profiles. Can be used for attachment of power die to lead frames or ceramic or organic substrates. The fusible alloy is Sn96.5Ag3.0Cu0.5.
Features an advanced three-component composite system that leverages polymer and metals technology. The material costs less than silver-filled adhesives.
Reportedly provides higher performance than Ag-filled adhesives at lower material and overall process costs. Controlled-collapse bond line ensures repeatable assembly characteristics and thermal performance. In applications where over-molding is performed, it eliminates problems associated with solder squirting. The polymer component is compatible with epoxy-based over-molding chemistry.
Kester, kester.com
Press Releases
- Stannol Welcomes James Wertin as Director of Technical Sales and Solutions – North America; Thomas Ruch Comments
- APE, Automated Production Equipment, Marks 56-year Milestone
- Kitron Signs Multi-Year Agreement for Advanced Sensor Manufacturing in Europe; Kristoffer Asklöv Comments
- Scanfil Boosts Investment in Electronics Manufacturing in the US; Christophe Sut Comments