TOKYO -- Tatsuta System Electronics Co. released a new EMI shield film, SF PC-5000, formulated for flex interconnects, COF, hinge applications in cellular phones, digital camera modules and LCD drivers. Total thickness is 22 microns. Well suited for dynamic flex operations, also acts as a covercoat.
Base dielectric is a soft epoxy only 5 microns thick, covered with 0.1 to 0.15 microns of silver and 17 microns of anisotropic conductive Adhesive. Said to exhibit excellent thermal stability during reflow with no blistering or warpage and minimal shrinkage. Comes with a matte black finish, a 50-micron PET transfer film for handling and a 120-micro film for protection.
Further info.and samples available from FRP Services & Co.: (914) 868-4090 Ext. 110; kobayashi@frpusa.com
Promation recently expanded their in-line label placement stations by adding a “Print on Demand” feature prior to the pick-and-place function.
ELC-100 is a standard in-line label pick-and-place station that uses the customer’s pre-printed label rolls. ELC-200 allows customers to print their labels (based upon select criteria) and have them placed on the PCB.
Both stations can accurately place labels, ranging from 7 x 7 mm to 40 x 40 mm, through the use of an x/y gantry and touch panel interface. Clamshell design allows full access to the labeling system.
Available with YL and LLX size internal conveyors.
Promation, pro-mation-inc.com
nLight, a manufacturer of high-power semiconductor lasers, has released a near-infrared (NIR) diode laser that emits 3W continuous-wave (CW) power from a single, 100-micron broad area emitter. Available in a C-Mount or High Heat Load (HHL) package, the high-brightness, 808-nm, multimode diode laser is a pump source for solid-state lasers, and heat or illumination source for medical and industrial applications.
Has an operating current of 2.8A and compliance voltage of 1.85V. Beam divergence is <36 degrees by <10 degrees, FWHM. As an added feature, nLight can include an AR-coated cylinder lens to collimate the fast-axis to <2 degrees, FWHM, with >95% power transmission.
NLight, nLight.net
To better serve the small volume user, Alpha-Core now stocks Round Magnet Wire from 34 to 14 AWG on 10 lb spools and Tinned Solid Copper Wire on 2 lb and 10 lb spools. Tinned solid wire, available both round and flat from 36 to 22 AWG, is used in pins and PCB connections while the magnet wire is used in board-mounted components in power supplies, voice coils in speakers and motor coils.
Alpha-Core, www.alphacore.com
CM1230 is the newest solution in the family of PicoGuard ultra low capacitance diode arrays for electrostatic discharge (ESD) protection of high-speed serial interfaces. With a space efficient CSP and an ultra low input capacitance of 0.8 pF per channel, is said to be the industry’s smallest form factor low capacitance ESD diode solution.
Data interfaces such as high-speed serial data interfaces for mobile handset displays as well as USB 2.0 and Serial ATA interfaces found in many digital consumer and computing applications require robust ESD protection for high value SOCs with low levels of capacitance and inductance to preserve signal integrity. Providing protection against ESD strikes up to ±8kV contact and ±15kV air discharge, the CM1230 meets the performance requirements of these applications.
California Micro Devices Corp., www.calmicro.com
A Mobile Device Rework (MDR) package with integrated solder paste dispenser has been developed to rework mobile phones, PDAs, gaming handhelds, multimedia portables, Bluetooth and WLAN equipment, memory cards, notebooks and portable medical equipment. The new package will be on display at booth 8715 at SEMICON West
The fully integrated rework system can dispense solder paste dots small enough for 0201 rework. Can also dispense additional materials including epoxy and underfill.
Equipped with a motorized placement module, WinCOMISS software controls bond force during placement and soldering.
Provides rework capability for the smallest of devices up to RF shield cans, and for the challenge of extremely high-density packages. The “cycle” includes device removal, residual solder clean-up, fresh paste dispense and component replacement. A fully automated version (Auto-MDR) is also available.
Finetech Inc., www.finetechusa.com