Circuits Assembly Online Magazine - Features

Mycronic 4.0 automated, intelligent factory software for just-in-time production enables visibility planning, material tracking, efficient changeovers, automated replenishment and intelligent storage solutions.

Mycronic, www.mycronic.com

DEK Nano Ultra Stencil is said to improve solder paste transfer by up to 40% in fine-pitch applications with area ratios of less than 0.6. Benefits include volume stability; clean edges for improved print quality; higher process stability; lower underscreen cleaning frequency (reduced underscreen cleaning fabric and cleaning solvent consumption). Coating thickness of 2 to 4µm.

ASM Assembly Systems/DEK, www.dek.com

Siplace TX series placement machines place components down to 03015/0201 metric in high volumes.

RSV series convection reflow soldering ovens include vacuum to reduce voids to fewer than 1%. Come in five or six heating zone versions, each with one vacuum zone and two cooling zones. Footprint is 5,070mm up to 6,229mm. Handle PCBs from 100 x 150mm up to 330 x 250mm. Large flux collection unit is said to reduce flux cleanings to a few times per year.

Eightech Tectron, www.eightech.com

Maxrel solder alloy comes in solder paste, preform and wire formats. Maintains shear strength after 1,000 thermal cycles under high CTE mismatch conditions. For LED chip-on-board (COB) assembly where high CTE mismatch can exist between the die stack and substrate, and creep fatigue properties of the solder material are important.

Alpha, alpha.alent.com/Markets/LED

Two Part Mix solder pastes come in two compartment bags that keep flux and solder powder separate from each other until mixed. Have two-year shelf life without refrigeration. Mix inside bag by squeezing flux toward powder, causing seal to release. Knead bag end-to-end for two to three minutes to fully mix the paste.

Chip Quik, www.chipquik.com