Spectrum II Premier with IntelliJet jetting is for dispensing small dot sizes at high frequencies for advanced packaging applications. Incorporates two-piece ReadiSet jet cartridge. Jets fluids in dot sizes from one to hundreds of nL. Closed-loop process controls integrate features for IntelliJet setup, calibration, and control. Is built on Spectrum II fluid dispensing platform. Has self-calibration features. Only wetted fluid path parts are changed on ReadiSet jet cartridge.
Nordson Asymtek, www.Nordsonasymtek.com
planarCT module is for phoenix microme|x and nanome|x x-ray inspection systems to inspect solder joints and packages in printed circuit board assemblies. Non-destructive planar CT scan technology is for slice-based and volume inspection. Can adjust scan parameters, place the board on the inspection table, close the door and start the CT scan. High-precision manipulation table rotates region of interest in the x-ray beam; DXR detector captures 2D x-ray image series for slice reconstruction. Reconstructed slice or multislice view allows inspection results of a single plane or a whole package without overlaying structures from other board areas.
GE Measurement & Control, www.ge-mcs.com
Alpha mult-level Precision Milled Stencils are designed to enable control of paste deposits when assembling printed circuit boards containing a variety of thicknesses. Reportedly provide flexibility in the transition from one thickness to another. Reduced pressure can be used when printing stepped stencils; have increased flexibility in design of the “keep-out” area. Enable use of closed-head printing systems.
Alpha, www.alpha.alent.com
MY600JD solder paste jet printer now has high-speed and high-precision capabilities. Suitable for semiconductor and SMT applications such as semiconductor chip encapsulation, cavity fill and conductive adhesive dispensing. Is said to achieve micrometer precision while delivering throughputs 2 to 10 times higher than those of traditional dispensers, depending on the application.
Mycronic, www.mycronic.com
STS-202 determines solderability of component leads and terminations prior to being joined in a soldering operation. Uses dip and look test method in conformance with IPC, ANSI and MIL standards, including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208. Uses comparative analysis technique. Can be used in receiving inspection or on a production floor, as well as in a testing laboratory. Is designed to automate physical testing process; uses high-precision motion control, touch screen programming, and PID temperature controls. Can also be used for manual component lead tinning for low-volume applications.
Ace Production Technologies, www.ace-protech.com
Tergo high performance flux remover is designed for cleaning printed circuit boards in automated vapor degreasing systems. Is a nonflammable, low-temperature cleaning fluid that features a nonvolatile additive engineered to clean challenging solder pastes and flux residues. Removes white residues. Effective on water-soluble fluxes. Has secondary applications as a degreaser and can remove slight oxidation and tarnish from finished surfaces. Is compatible with vapor degreasing procedures. No hardware modifications normally are required. Is compliant with current and proposed European environmental, health and safety regulations.
MicroCare, www.microcare.com
Press Releases
- Incap UK Invests in SMT Technology as Part of Long-Term Operational Development
- Evolve Manufacturing Celebrates 100 Years of Combined Leadership in Medical Device Manufacturing; Noreen King Comments
- STI Celebrates Christy Hill’s 20 Years of Dedicated Service; David Raby Comments
- Medco West Enhances PCB Cleaning Capabilities with Installation of Typhoon T9 Aqueous Inline Cleaner; Peter Sowinski Comments