AGC Multi Material Reusable Silicone Tape is for temporary fixation during SMT processes.
Cetec ERP versions 4.16, 4.17, and 4.18 include new features to streamline production, optimize inventory management, and improve communication.
Takaya APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism and sensing technology and user-friendly interface said to reduce the load and improving operator efficiency.
Shenamo PF925 near-eutectic solder is said to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics.
Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.
Cybord Real-Time Interception (RTI) visual AI-powered software is said to prevent defective components from being assembled on printed circuit board assemblies (PCBAs) in real time.
Press Releases
- Datest Launches 2026 Webinar Series: Because Electronics Testing Shouldn’t Be Guesswork
- ASE CEO Tien Wu to Keynote IEEE ECTC 2026 in Orlando
- Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc. a subsidiary of Blackstone Global, Across the United States and Canada
- MicroCare Appoints Uwe Wanner as Director of Research & Development