Results of a cross-industry team’s development and testing of a PCB-based embedded chip technology for an under-the-hood automotive application.
Over the past five years, laminated-based chip embedding has taken a huge step toward industrialization. Meanwhile different products in the low- and medium-power application are commercially available.
Stencil design software has evolved from simple rule checkers to custom, sophisticated engineering tools.
QFNs, microBGAs and 0201s keep showing up everywhere. They used to appear only on boards requiring miniaturization; now they are used on revisions of legacy products, bringing a new set of headaches for process engineers.
The electronics assembly industry (along with a few fabricators) agrees that better times are ahead in 2014.
IPC Apex Expo in late March was judged by most to be a success, with attendance showing some signs of life, and a lot of machines listed SOLD signs. It was difficult to say whether there’s a consensus about moving back to San Diego next year or staying in Las Vegas, where the show was this year.
Faced with a doubling of its workforce, a new production schedule emerges.
One of the big hurdles in the reshoring trend is recruiting new talent as jobs come back. After two decades of focus on growing the service economy while watching manufacturing move offshore, the pool of trained production workers has shrunk dramatically.
Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.
Numerous critical process parameters must be monitored and controlled to efficiently and effectively yield the expected cleaning results for a qualified cleaning process.
A systematic approach to nonconventional methods of encapsulant removal.
An unfortunate reality is that the circuits we assemble do not always perform as expected. Failure analysis is frequently needed to find root causes.
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments