Achieving sufficient paste volume fill of fine-feature apertures is tied to stencil design.
As a contract manufacturer do you want more results with less effort? The simplest of tools could be the most effective.
As the economy continues to improve more manufacturers are making capital investments to fuel their growth. When business owners and managers consider acquiring equipment, they often think of their payment option as a “lease versus buy” decision.
Changing markets and changing times have brought new management and new vision to the Tier III EMS.
A total of nine groups of PCB surface finish were evaluated for solder spread and voiding performance with assembled BGAs and QFNs.
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments