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A total of nine groups of PCB surface finish were evaluated for solder spread and voiding performance with assembled BGAs and QFNs.

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As printed circuit boards become smaller, the challenges faced when coating them grow. It is increasingly important that products are protected from damage from moisture, dust and other dirt, which can lead to interference and even cause the board to fail.

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Using IPC standards, a study identifies and qualifies an aqueous cleaning process capable of removing combinations of no-clean flux residues for high-rel boards.

In this study, a global contract manufacturer received a contract to manufacture Class III devices for a large medical OEM. Since these products are manufactured with no-clean flux, the OEM requested extensive testing, evaluation and validation to confirm that the selected cleaning process is capable of removing all flux residues and thereby ensuring the long-term integrity and reliability required of Class III products.

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For the world’s top PCB manufacturers, Apple and Samsung can make (or break) you.

For those who believe nothing changes in printed circuits, think back just 16 years to the first edition of the NTI-100. The biggest names in PCB manufacturing included Photocircuits, Lucent and Hadco, among others. TTM was just being incorporated. The US and Japan were battling for worldwide bare board supremacy. Taiwan was a relative newcomer, China an after-thought.

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Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.
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Confusion reigns over first article inspection and whether it is a qualification requirement. (It isn’t.)
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