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Written by Feng Xue, Matt Kelly, Curtis Grosskopf, Paul Zulpa, Yvonne Chii Yeo, Ron Xiyuan Yin, Agustin Solis, Carlos Nuno Velarde and Zoltan Barabas
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Streamlining governing processes in audit execution and auditor training.
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Written by Fredrik Mattsson, David Geiger, Dongkai Shangguan, Ph.D. and Todd Castello
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This study finds a process similar to 0201 parts, with a 100 µm thick stencil and a nitrogen environment.
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Written by Robert Darveaux, Howard Chen, Shaul Branchevsky and Mahendra Harsha
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A methodology to calculate solder joint height is used to conduct a tolerance analysis on BGAs.
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Written by Mike Buetow
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Silicon Valley’s choice for one-stop shoppers is gaining a national reputation for handling the toughest boards.
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