Book Reviews
HELSINKI, FINLAND – Incap has lowered its 2026 profit outlook, citing margin pressure in certain market segments and ongoing global material availability challenges, while maintaining its revenue forecast.
GALWAY, IRELAND – TE Connectivity has entered into a definitive agreement to acquire Astrodyne TDI, expanding its portfolio of power management and electromagnetic interference (EMI) filter technologies for industrial and mission-critical applications.
PEACHTREE CITY, GA – CIRCUITS ASSEMBLY is accepting entries for its 2027 New Product Introduction Awards for electronics assembly equipment, materials and software suppliers.
TAIPEI, TAIWAN -- Global NAND Flash supply is expected to outpace demand in the second half of 2027, easing the supply constraints that have persisted throughout 2026, according to TrendForce.
EINDHOVEN, THE NETHERLANDS -- Keiron Printing Technologies has raised $24 million to accelerate commercialization of its laser-Induced forward transfer (LiFT) solder paste printing technology for electronics assembly.
Press Releases
- Altus Adds LPKF CuttingMaster 3290 to Depaneling Portfolio
- Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin
- XLR8 EMS Welcomes Raul Jorge Lopez Jr. as Director of Program Management and Procurement
- Koh Young America Promotes Ramiro Mora to Lead Service and Applications in Mexico and South America