Indium Corporation to Showcase Expertise and Proven Products for EV at IPC APEX Expo
CLINTON, NY — Indium Corporation is proud to showcase its innovative products for electric vehicle manufacturing and e-Mobility, as well as thought leadership and expertise within this rapidly-evolving market, at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.
With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions which are designed to be reliable, scalable, and proven materials to reduce electric vehicle (EV) manufacturers’ time to market.
More than three million EVs are on the street with Indium Corporation’s Rel-ion™ products. Rel-ion™ material solutions deliver reliability by:
- Eliminating non-wet opens and head-in-pillow defects
- Preventing dendritic growth by meeting stricter surface insulation resistance requirements
- Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
- Reducing hot spots-induced voiding through improved thermal efficiency
Some of the Rel-ion™ suite products include:
- Award-winning Durafuse™ LT, a novel solder paste mixed alloy system with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup
- The Indium8.9HF Solder Paste Series, an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to enhance electrical reliability, improve stability during the printing process, and deliver low-voiding for high-reliability automotive electronics
- InFORMS®, reinforced solder alloy fabrications, improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
In addition to featuring its proven products, Indium Corporation’s Global Head of e-Mobility and Infrastructure, Brian O’Leary, will co-chair a special panel discussion on e-Mobility on Thursday, January 26 from 10 a.m.–1 p.m. local time. The session, one of the first of its kind, will bring together key stakeholders from across the e-Mobility industry, including original equipment manufacturers (OEMs), their supply chain regulators, policy, and technology experts.
- To learn more about why more than 3,000,000 electric vehicles are on the road with Indium Corporation’s proven materials, visit them at booth #2339 or at www.indium.com.
