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June 22, 2021 - Haverhill, MA, USA - Circuit Technology Center announces that it has issued a purchase order to RPS/Hentec for two additional Odyssey 1325 robotic hot solder dip (RHSD) machines. The Odyssey 1325 is a MIL spec complaint, high-volume, high-mix component lead tinning machine equipped with auto load/unload and is capable of processing dual solder alloys. The equipment complies with all applicable GEIA-STD-006, J-STD-001 and IEC TS 62647-4 standards.

This purchase will double the existing capacity of Circuit Technology Center's component level modification services department to meet the increasing demand from the defense and high reliability customer base that require component level modification/alteration for tin whisker mitigation, gold mitigation and lead re-conditioning applications. This state-of-the art equipment is also used for automated, touch-less BGA component de-balling, required as part of converting BGA’s with lead free solder to tin-lead solder.

"For nearly 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification and damage repair services," said Andy Price, Sales Manager at Circuit Technology Center. “We are thrilled to announce this capacity expansion, offering our defense and high reliability customers component level modification and alteration services with the same level of exceptional quality and service that they have come to expect from our company.”

Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.

For more information, please visit: www.circuitrework.com. Phone: 978-374-5000, Fax: 978-372-5700, Web: www.circuitrework.com.

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