Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities

Newman Lake, WA (February 9, 2021) – Hentec Industries/RPS Automation is pleased to announce that Circuit Technology Center has installed its second Hentec/RPS Odyssey 1325 robotic hot solder dip machine. The Odyssey 1325 is a MIL spec complaint high-volume, highmix component lead tinning machine equipped with auto load/unload and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA deballing. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF38524E and ANSI-J-STD-002 standards.

“Hentec Industries is an instrumental partner to Circuit Technology Center as we continue the expansion of our BGA re-balling and component tinning services department to support our high reliability and defense industry customer base”, said Jeff Ferry, President of Circuit Technology Center. “We have now purchased multiple systems from Hentec, and they have been terrific to work with, implementing a variety of custom options to their standard Odyssey 1325 RHSD platform to suit our specific requirements. Customer support from upper management to their field service department has been top notch.”

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