Indium Corporation will feature its precision materials for high-reliability 5G communications during the International Microwave Symposium (IMS) virtual exhibition from Aug. 4-6.

Indium Corporation provides a suite of leading-edge materials and technology expertise to solve the evolving challenges of 5G communication applications. This includes AuLTRA ThInFORMS—0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers commonly used in 5G communication infrastructure.

AuLTRA ThInFORMS help combat common issues, such as:

Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
Poor thermal transfer—the ultra-thin 0.00035” preform reduces bond-line thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device

Indium Corporation also offers off-eutectic AuSn alloy options. These materials are designed to control wetting and voiding, yielding a high-reliability solder joint for critical high-power, high-frequency applications.

The IMS virtual exhibition will facilitate the benefits of a face-to-face trade show on a digital platform. For information on this topic or to chat with our experts, visit Indium Corporation’s virtual booth.

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Register now for PCB West Virtual 2020, the leading conference and exhibition for the printed circuit board industry, coming this September. pcbwest.com

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