caLogo

[July 14, 2020 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON Asia held at the Shenzhen Exhibition & Convention Center to feature Innovative SMT Inspection solutions for the Smart Factory. Visit booth #1C65 to experience Smart Factory Inspection Solutions in action.

TRI will unveil the 3D AOI TR7700Q SII with improved optical system that increases stability and increases speed up to 25%, compared to the last model. TRI will also showcase the high-resolution 3D AXI TR7600F3D SII with unprecedented speed.

Furthermore, TRI will be presenting the Multi-Angle 3D AOI TR7500QE offering higher quality imaging, and the Global Technology Award-winning 3D SPI TR7007Q, designed for Zero-Escape Industry Applications. Additionally, TRI will present the Multicore ICT TR5001Q SII Inline and the MDA TR518 SII Drawer with 2560 testing points.

Visit TRI's booth #1C65 at NEPCON Asia to discuss your Production Line requirements, and experience Smart Test and Inspection Solutions for the Connected Factory.

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article