Shingle Springs, CA — June 2020 — PDR X-ray Solutions is pleased to announce that its 2D and 2D+ X-ray systems have set a new industry standard for high-quality X-ray images at an affordable price. Choosing the correct system for your requirements such as X-ray for quality control or X-ray for process control is vital for the success of both X-ray circuit board inspection programs as well as X-ray semiconductor inspection programs.

PDR’s 90kV X-ray and 130kV X-ray systems are engineered with high-quality materials and craftsmanship and X-ray safety standards exceeding the most stringent requirements for industrial safety. All X-ray non-destructive inspection systems built by PDR are equipped with a suite of X-ray image processing tools and features that incorporate cutting-edge technologies to ensure that your X-ray system delivers quality X-ray images and the power of analytic tools required for a successful X-ray program.

Surface mount and assembly inspection is vital for providing quality product. PDR’s BGA X-ray defect detection and BGA X-ray inspection starts with high quality X-ray images with outstanding image clarity. This makes possible the highest level of analytical tool outcomes utilizing PDR’s proprietary software to perform a high level analysis of BGA packages, X-ray for solder ball sphere void percentage calculations, solder ball area and roundness (spherocity), as well as analytical tools to address X-ray for QFN package inspection, X-ray for CSP package inspection,  and X-ray for flip chip inspection as well as X-ray for QFP package inspection and more…

PDR X-ray systems oblique view capability (up to 70°) offers the ability to rotate your sample (PCB, component, SMT device, etc.) to allow X-ray inspection of bond wire quality and perform X-ray bond wire sweep analytics, X-ray of solder fill for PTH – X-ray barrel fill analysis and more.

Whether  your X-ray needs are failure analysis to detect and measure die attach voiding, bond wire Attach, etc.) only, or to resolve production issues such as X-ray solder bridging, shorts, opens, insufficient solder, solder paste inspection, head-in-pillow (HiP) issues or solder wetting issues, or simply to validate processes for X-ray inspection of array packages such as BGAs, QFNs, CSP and flip chips, PDR X-ray systems provide the tools  to successfully manage your X-ray program with affordability in mind.

PDR systems are made in the USA with worldwide service and support, and one-year or multi-year warranties. PDR can help to determine the best X-ray source and detector depending on the application.

Register now for PCB West, the leading conference and exhibition for the printed circuit board industry! Coming this September to the Santa Clara Convention Center. pcbwest.com 

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