TRI to reveal 3D Micro Components Inspection Solutions at SEMICON Taiwan 2018
[July 17, 2018 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan 2018. TRI will showcase state-of-the-art 3D Automated Micro SMD Inspection Solutions. SEMICON Taiwan will be held at the Nangang Exhibition Center in Taipei, Taiwan, from September 5th to 7th, 2018. Visit TRI at booth # I2100 to discover High-Precision Inspection for the Semiconductor Industry.
TRI's VP of Sales and Marketing Jim Lin commented on the occasion, "We are delighted to share how TRI's newest 3D technology for Zero Escapes and Zero False Calls help our customers achieve microscopic-level inspection and increase production efficiency.”
Presenting an integrated solution for the Advanced Packaging production line, TRI will exhibit the Global Technology Award-winning TR7007Q 3D SPI with Shadow-free Precision Inspection and High Repeatability and Reproducibility. TRI will also showcase the internationally acclaimed 3D DFF AOI TR7700Q with unprecedented 1um High-Resolution. Increase Yield and Reduce Rework with TRI's Innovative Precise Inspection with Leading High-speed CoaXpress Imaging Technology. Test Research, Inc.'s Metrology grade inspection is suited for the Semiconductor industry that continues to shrink the size of electronic devices. With 1um High Resolution Inspection TRI catches up with the miniaturization trend and ensures higher yields and fewer failure rates in the Semiconductor Packaging Production Lines.
Discover TRI's new Micro SMD and Packaging Inspection solutions at booth # l2100 of SEMICON Taiwan 2018.
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