FRANKLIN, MA – Endicott Interconnect Technologies (EI) has chosen the MPM Accela printer, made by Speedline Technologies, for its SMT and semiconductor back-end assembly processes.  The companies are jointly conducting beta testing on several new, advanced hardware and software options for the printer. 
 
These advances will leverage Speedline’s patented texture-based inspection algorithms to develop exponentially higher resolution 2-D inspection capabilities. This will enable the ultra-fine feature 2-D capabilities required by emerging higher-density assemblies that employ smaller or finer pitch components.
 
In addition to this joint inspection development, EI plans to use the Accela printers to process substrates in flat carriers, as well as perform fine feature assembly inspection in their Endicott, NY, facility.

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