LOS ANGELES – iNEMI today announced its 2007 iNEMI Roadmap will be available to industry next month. The latest edition of the biennial document charts electronics manufacturing’s technology and infrastructure needs through 2017.  It also discusses market convergence, miniaturization, harmonization of environmental requirements, migration of manufacturing and R&D, reliability, printed electronics and more.

Organic and printed electronics. New to this edition of the roadmap is a chapter on organic and printed electronics. Applications such as wearable electronics and item-level RFID tags are driving this emerging technology. Printed electronics uses graphic arts-like printing processes to fabricate electronic components.  Taking advantage of new functional electronic inks, this novel approach to electronics manufacturing has the potential to dramatically reduce cost and complexity while significantly increasing throughput. 

For applications that don’t require the speed and density of today’s silicon-based technologies, the potential benefits are significant and could help develop totally new markets for electronics. Flexible displays, lighting, sensors, RFID and smart packaging are some of the products that show early promise for printed electronics.

The technology has matured in recent years, migrating from the lab to prototype production, and a supply chain is beginning to emerge.  The iNEMI roadmap provides an overview of the most critical technologies necessary for commercial launch and market diffusion of organic and printed electronics-based products.  To the best of iNEMI’s knowledge, this is the first industry roadmap of this technology.

Market convergence. As electronic products become more ubiquitous in society, the lines between product sectors are blurring.  This convergence of market segments puts increasing demands on performance, cost and harmonization of interface standards.  For example, consumer products are now finding their way into automobiles and medical applications where specifications have traditionally been quite different.

Miniaturization. Portability remains a key driver of technology as the need for miniaturization demands breakthroughs in materials properties, packaging and assembly technologies.  Since these applications can lead to significant volumes, the supply base is motivated to invest in these areas while other segments are less able to attract investment to meet their specific performance and reliability requirements.

Migration. The migration of capabilities is continuing and includes not only manufacturing functions but also R&D.  This migration facilitates the development of emerging markets and can provide solutions that are fast to market due to better understanding of local needs.  This trend also impacts the role of the developed regions as they take on more of a manufacturing/design integration function (at least for some segments).     

Environmental harmonization. Proliferation of environmental requirements continues around the globe.   Unfortunately, harmonization of the myriad requirements remains a significant challenge for industry. Industry is showing increased interest in developing science-based environmental solutions in advance of new regulations so that the end results can be achieved with lower risk and greater predictability. 

While consumer electronics have made a full conversion to Pb-free, the high-reliability sectors must address a number of knowledge gaps before conversion can be undertaken.    

The 2007 iNEMI Roadmap will be available to industry on CD-ROM, beginning March 5.  CDs can be purchased online ($250 for non-members) at http://www.inemi.org/cms/roadmapping/roadmaporder.html A 68-page executive summary is available for $50.