Products
A full range of precious metal clad products for fabricating micro-switches, connectors and components used in high-reliability medical, military and consumer products is available from Anomet.
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
Micro HVR addresses the high-volume rework market where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical. For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component de-solder and discard, residual solder removal, flux dispense (where necessary) and component re-solder. All steps are automated.
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
IBIS, the Interferometric Bump Inspection System, offers production volume solder bump inspection on chip carriers. It inspects and reports on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that carriers are within specification for chip attachment.
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
CDS6250 automatic system can dispense up to 150 drops/sec. (540,000 drops/hr.). Nanojet dispensing valve produces dots down to 2 nl. Three-axis system is programmable and can dispense adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist, conformal coating and more. Almost all media with a viscosity between 50 and 200,000 mPas can be dispensed.
Unlike other needle-based dispensing systems, the gap between the jet valve and the substrate can vary. As a result, the dispenser can travel at a fixed height while the substrate’s height changes.
Very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100°C.
Features RO-CONTROL software for increased process simulation and control. The software offers many of the same features as thermal profilers.
The high air volume of guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T. Options for the 80" long oven include: chain conveyor for double-sided boards, computer control and an N2 option.
Can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift.
Essemtec, essemtec.com
Apex booth 2433
Unlike other needle-based dispensing systems, the gap between the jet valve and the substrate can vary. As a result, the dispenser can travel at a fixed height while the substrate’s height changes.
Very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100°C.
RO300FC full convection reflow oven is said to allow fast, homogenous heating. The integrated convection technology has a vertical hot air stream that evenly heats the complete PCB. Both standard and Pb-free pastes can be used.
Features RO-CONTROL software for increased process simulation and control. The software offers many of the same features as thermal profilers.
The high air volume of guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T. Options for the 80" long oven include: chain conveyor for double-sided boards, computer control and an N2 option.
The temperature of the pre-heat and the peak zones along with the conveyor speed are programmable to obtain the required soldering profile. Measuring the zone temperatures directly in the convection airflow guarantees reproducible results with Delta-T values at ±2°C. Different profiles for solder and glue are integrated in the microprocessor control.
Can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift.
Essemtec, essemtec.com
Apex booth 2433
Auto-Focus software automatically selects the best reflow oven recipe for new products without running a profile by evaluating a database of previously setup products and extrapolating a new oven recipe based on product and oven characteristics. Instead of relying on a technician’s guess, the user enters the product’s length, width and weight. After a dozen products that cover the required range have been set up properly, the accuracy and quality of the oven recipes developed is so high that most users may no longer find it necessary to run a verification profile.
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
KIC, kicthermal.com
Booth 363
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
KIC, kicthermal.com
Booth 363
The manual version of Fineplacer Lambda is used for sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V l. Can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system.
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
Finetech Inc., finetechusa.com
Booth 1481
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
Finetech Inc., finetechusa.com
Booth 1481
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