Products
Redesigned Siemens ceramic replacement nozzles offer placement down to 01005 components. Are compatible with Siplace, CS, CF, D1, D2, D3, D4 F5, HM, HS-60, HF, S-27, HM, X2, X3, X4, X4i and SX. Have special vacuum geometry and are ESD-safe. Bodies machined from high-strength plastic. Reportedly will not crack or break under normal working conditions. Come individually or in six-packs in 901, 902, 904, 906 and 925 versions.
Count On Tools Inc., www.cotinc.com
The IPC J-STD-001 Certification Kit now has a Pb-free option. Components are representative of those commonly experienced. Is packaged with enough components to populate the two boards provided. Permits skill development using one board and final assessment with the other. Components and boards also can be purchased individually.
STI Electronics Inc., www.stielectronicsinc.com
Uniflow3 power supply is for resistance soldering, heat sealing and conductive adhesive bonding applications. Replaces Uniflow2 power supply, and features hardware improvements, new process control features, upgraded limit and alarm options, and user interface upgrades. Uses pulsed heat technology; provides targeted heating and precision temperature control for flex circuits, ribbon cables, wires, SMT components, single or dual-sided edge connectors and thermocompression bonding of gold ribbon. Is used in the assembly of medical devices, cellphones, onboard computers, LCD monitors, laptops, and cockpit instrumentation and displays.
Miyachi Unitek, www.miyachiunitek.com
Value Line of low-humidity desiccant cabinets includes three models, with internal capacities of 7, 22 and 44 ft.3. Prevents defects to components and assemblies caused when moisture content becomes vaporized if soldered under high temperatures. Safely stores MSD trays and reels for extended periods in an RH atmosphere of 5% or less. Each of the models provides two or more turbo modules designed to rapidly decline RH to this level without use of nitrogen or compressed air.
Manncorp, www.manncorp.com
BPWin version 5.10 features benefits for software support, such as email notifications, black box log visualization and label printing. An email notification feature for automated programming systems sends instant notifications of system events, plus a job summary report. Can set up email notifications to multiple users or a single user when a certain job event takes place. Black box log files can be viewed graphically with the log visualization feature. With color-coded data and letter-designated events, the log visualization feature can help determine what set of circumstances contributed to an unexpected event or other performance metric. Identifies and maintains programmed device traceability. Prints labels using dynamic data from the current job, such as device quantity, job master file name, job ID, device part number, data pattern information and system information. Interfaces with printer using Windows print driver and a text-based command language. Generates text, barcodes and RFID tags.
BPM Microsystems, www.bpmicro.com/bpwin-features.html
XPM3i reflow system has an enhanced atmosphere recirculation system said to deliver nitrogen savings of up to 50%. Can be equipped with dual-lane, dual-speed conveyor option for high-mix processing. Includes new software features. Is equipped with AUTOset fast setup; makes it possible to accelerate process development by generating a preliminary reflow recipe based on PCB assembly’s physical characteristics. Can fine-tune preliminary recipe if needed; 85% of the time, modifications are not needed.
Vitronics Soltec, www.vitronics-soltec.com
Press Releases
- Robert C. Donovan Joins DISTRON CORPORATION, Marking the Third Generation in Family Leadership
- Incap UK Invests in SMT Technology as Part of Long-Term Operational Development
- Evolve Manufacturing Celebrates 100 Years of Combined Leadership in Medical Device Manufacturing; Noreen King Comments
- STI Celebrates Christy Hill’s 20 Years of Dedicated Service; David Raby Comments