Unscrambler X 10.3 multivariate data analysis and design of experiments software now offers better plotting tools, sample selection techniques, a new spectroscopic transformation, an improved DoE module and better handling of process data. Includes exploratory data analysis, regression and classification methods, predictive modeling, and descriptive statistics. Units and ranges can be defined and saved with PLSR, PCR, MLR and PCA models for assigning multiple input parameters; can set alarm and warning limits for PLSR, PCR, MLR and PCA models; has an optional plug-in enabling direct import from OPC DA servers and OSISoft PI databases. Includes interactive response surface plots in the DoE module. D-optimal designs in the DoE module have been enhanced. Has 2D-scatter plots automatically grouped by first category variable in data tables, sample labeling by data value, and new outlier plots with F-residuals. Sample selection tools now include the Kennard-Stone method. A spectroscopic attenuated total reflectance transformation has been added to correct for wavelength-dependent light penetration effects in IR spectroscopy.

CAMO, www.camo.com

Indium6.4 solder paste is water-soluble and said to minimize voiding under QFN and BGA assemblies. Reportedly yields less than five% voiding. Comes as standard type 3 powder in Sn63, Sn62, and Indalloy100 (tin, lead and silver).

Indium, www.indium.com

EP21FRNS-2 two-part epoxy has a non-halogen filler. Passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications. Produces low smoke levels.  Features one to one mix ratio by weight and cures at room temperature or more quickly at elevated temperatures. Bonds to a variety of substrates including metals, glass, ceramics and many plastics. Withstands exposure to a range of chemicals, such as water, fuels, lubricants and acids, among others. Serviceable over temperature range of -51° to 90°C. Comes in ½ pint, pint, quart, gallon and 5 gal. kits, premixed and frozen syringes, bubble packs and gun dispensers. Is for the computer, aerospace and other industries.

Master Bond, www.masterbond.com

CA-105 conductive LED die attach adhesive is for attaching LEDs and other small semiconductor die to silver and copper lead frames. Has a high glass transition temp. to facilitate wire bonding small die; has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispensing open time (pin transfer) greater than 24 hr. (measured as a 25% increase in viscosity).

Engineered Material Systems, www.emsadhesives.com