Delomonopox VE 72768 dual-curing epoxy resin offers bonding accuracy and is resistant to substances like oil, transmission fluid, gasoline, methanol and printing ink. Designed with hardeners, it is used where bonded or encapsulated components are exposed to extreme temperatures and harsh chemicals. Permits defined glob top encapsulation in tight spaces on a printed circuit board. With light curing, glob top forms a skin and can “freeze” its shape; adhesive doesn’t flow away during heat-curing process. Curing is a two-stage process: Adhesive is light-fixed in up to 5 sec. to achieve a die shear strength of more than 1N on the FR4 PCB material; then it is briefly heat cured (for example, 30 min. at 150°C) to obtain its full strength of 50MPa on FR4. Is offered in two viscosities, one for bonding applications and another for encapsulation.  Operating temperature range is from -65°C to 180°C.

Delo, www.delo.de/en/

NeoHorizon screen printer features a totally modular design. Can be equipped with various clamping systems, conveyors, sensors, camera systems and the latest version of the DEK ProFlow ATx printhead system at any time. Core cycles time 7.5 sec. and accuracy rating of up to 15µm @2 Cmk. New, robust cover makes it possible to perform all operations and maintenance from front of machine. Back-to-back configuration provides dual-track solution, or can be split and installed on separate lines. 03 iX model comes with DEK HawkEye 750 camera system, semiautomatic stencil alignment and new IUSC understencil cleaning system and has a core cycle times of 8 sec. and accuracy rating of 20µm @2 Cmk, for high-mix environments. 01 iX model has a core cycle time of 7.5 sec. and machine accuracy rating of 15µm @ 2 Cmk, HawkEye 1700 camera system, fully automatic stencil loading and DEK Cyclone understencil cleaning system.

ASM, asm-smt-solutions.com