EMS 561-854 conductive adhesive for die-attach applications with small- to medium-size die and tantalum capacitors is designed to cure in one minute at 170ºC. Is stress-absorbing, designed to withstand the rigors of thermal cycling, and features conductive stability. Applicable by pin transfer or needle dispensing.

Engineered Materials Systems, www.emsadhesives.com

SF855-LR soldering flux is a low-solid, low-residue, no-clean, non-rosin organic flux designed for use in tabber and stringer equipment of PV through soldering tabs to cell contacts. Low solids content (1.6%) and nature of activator system reportedly result in nearly no residue left on cell after soldering. Wide operating window and temperature range; can be used in SnPb, SnAgPb and Pb-free applications.

Kester, www.kester.com

GTAz optical head comes on PowerSpector and SpectorBOX AOI machines. Delivers stereoscopic imaging using nine high-speed (90 Fps) cameras operating in full 24-bit color. Image differentials are merged and a vectorized map of the component created, then analyzed based on programmer-applied tolerances. Requires no active light projection, and thus is less costly and compact, for desktop systems. Removes need for capture cards utilizing Thunderbolt2 20GBs transfer speeds and full frame transfer. Views side of components rather than extruded 2D images (as with single-camera systems). Has 3D features such as verification of body height, tilt and coplanarity; and 2D benefits of fast programming and pin height and solder meniscus profile analysis, component presence/absence, polarity, value, angle, offset, color, extra part detection, solder ball detection and short detection. Line-sourced DOAL (direct on axis lighting) coaxial lighting system with high-resolution telecentric optics enables inspection of solder joints without shadow effects from tall components nearby as well as accurate inspection model building. Omnidirectional multi angle, multi-color LED lighting provides optimal illumination regardless of component direction.

Mek (Marantz Electronics), marantz-electronics.com

EMS 561-567 snap cure conductive adhesive is for stringing or shingling applications in crystalline silicon and thin-film solar modules. Is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact. Is stress-absorbing, designed to withstand the rigors of thermal cycling, and reportedly features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Cures in seconds at 150°C to 180°C.  

Engineered Material Systems, www.emsadhesives.com