CLINTON, NY – As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices.
• Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.

Some of the additional products featured will include:

• Indium8.9HF Solder Paste Series, an industry-proven solder paste series, delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
• SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.
• Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
• NC-809 is Indium Corporation’s first no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.

  To learn more about Indium Corporation’s solutions, visit our experts at Productronica India in hall 14, booth H14.B65.

CONKLIN, NY – Universal Instruments will join parent company Delta, a global leader in power and thermal management technologies and a world-class provider of industrial automation solutions, on booth S7542 at the SEMICON Taiwan trade show on September 4–6. The booth will feature a seamless integration of semiconductor solutions, including Delta’s Wafer Edge Profile Measurement Machine for front-end processing and Universal’s FuzionSC™ and High-Speed Wafer Feeder back-end multi-die placement solution. Delta will also showcase its Digital-Twin (DlA-Twin) simulation software and adoption of the SEMI E187 cybersecurity practices, surpassing current industry standards.

The Wafer Edge Profile Measurement Machine measures the notch, flat length and edge shape of the ground wafer while also detecting wafer quality and defects. It employs non-destructive AOI optical technology to take these measurements with micro-scale repeatability, which achieves a high throughput of approximately 60-120 wafers per hour. The system supports automated robotic loading/unloading and AGV transport systems, combining diverse functions into a single machine. Delta also offers additional front-end processing solutions including Wafer Edge Grinding, Sorting and IR Pinhole Inspection.

DIATwin is an intelligent design and development tool that can precisely simulate loading points and paths in a virtual environment, enabling the evaluation of production cycle times and reducing the trial-and-error costs in new product introduction. Integrating the DIATwin Virtual Machine Development Platform with front-end equipment to create virtual environments greatly improves efficiency of new product introductions.

The FuzionSC Platform combined with the HSWF is the ultimate solution for challenging multi-die package applications. It’s capable of placing passives and multiple die types in a single cell, eliminating the need to move product between cells and maximizing accuracy and efficiency.

Universal Instruments Vice President of Global Customer Operations and Corporate Marketing, Glenn Farris stated, “The complementary semiconductor solutions we’re able to offer put our customers at the forefront of this fast-moving target. Tying front-end and back-end equipment and processes together, leveraging AI and digital twin technologies to streamline NPI and production, and protecting assets with advanced cybersecurity are all integral advantages.”

Along with visiting the booth, Universal encourages attendees to join a technical presentation by Universal Instruments VP of Global Customer Operations and Corporate Marketing, Glenn Farris. On Friday, September 6 at 11:20 am CST at the HITECH Smart Manufacturing Forum he will present “Accelerating Innovation: Smart Manufacturing for Advanced Semiconductor Packaging”.

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com 

SANTA CLARA, CA – TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, will be exhibiting highlights of its advanced technology at SMTA International, October 20 - 24, 2024, at the Donald E. Stephens Convention Center in Rosemont, Illinois USA. In the booth, a tabletop video will illustrate features of the APT-1600FD system and promote features including Takaya’s FastTrack CAD conversion software. FastTrack CAD conversion software is a fully integrated solution from CAD import to final test of products.

Takaya’s APT-1600FD Advanced Flying Probe test system for assembled PCBAs provides average head-speed increases of up to 50% with throughput improvements of 30-50% over existing models, making it the industry’s fastest flying-probe test system.

As part of the Plus Infinity suite, FastTrack ODB++ saves time and eliminates unnecessary work. For example; The conversion can be based on various factors including a comparison of differences in the files. If an existing test program is generated from an ODB++ file, then FastTrack ODB++ is able to compare a revised ODB++ with an existing one and convert only the part where changes have been made. Using this function helps greatly reduce the time and cost on test program debug, since users do not need to create a test program from scratch.

Takaya will also show how the integration of an OPC_UA server fully supports Industry 4.0 standards. “An OPC UA Server is installed inside the Takaya system,” says David Levine, TEXMAC-Takaya U.S. Western and Brazil Region Manager. “It communicates with the PC and the Takaya APT software. Once installed and set up, it communicates with the customer's MES system via Ethernet.”

Vertical communication information exchange between an MES Server and the Takaya APT software offers many possibilities for seeing real time test data and controlling your test profile based on real time test results, he adds. “It’s another step by TAKAYA in the realization and implementation of Industry 4.0 goals.”

All TAKAYA systems are now shipping with the APT Plus Infinity Operating System environment. For more information, visit www.texmac.com/takaya/ 

CYPRESS, CA – Hanwha Techwin Automation Americas, Hanwha Precision Machinery’s North America branch office, and a leader in precision manufacturing and technology solutions, is proud to announce a strategic partnership with Neotel Technology, a global leader in intelligent automation technology for smart material handling. Under this agreement, Hanwha Techwin Automation Americas will be the primary distributor for Neotel products across the Americas, including the United States, Canada, and Mexico, providing both sales and service support.

Neotel Technology is renowned for its innovative solutions that significantly improve yields and productivity while providing operating cost benefits. Their product line, which includes the SMD BOX MIMO, NEO Light Mobile, and Neo Scan, will be showcased at the upcoming SMTA Guadalajara show on September 11-12, 2024, in Guadalajara, Mexico. This partnership positions HTAA as the go-to source for Neotel's cutting-edge automation technologies in the region.

“We are thrilled to partner with Neotel Technology as their primary distributor in the Americas,” commented Tim Kang, CEO of Hanwha Techwin Automation Americas. “This collaboration allows us to offer our customers unparalleled access to Neotel’s advanced material handling solutions, combined with our commitment to providing exceptional sales and service support. By integrating Neotel’s intelligent automation technology into our portfolio, we are empowering our customers to enhance their production efficiency and stay ahead in a competitive market. This partnership is a significant milestone for Hanwha, as we continue to expand our offerings and deliver innovative solutions that drive success for our clients.”

Neotel’s products, such as the SMD BOX MIMO and Neo Scan, are designed to automate and optimize material flow in electronics manufacturing, ensuring complete smart material management. With this new partnership, Hanwha Techwin Automation Americas will not only provide these state-of-the-art products but will also offer comprehensive service and support, ensuring that customers can fully leverage the benefits of Neotel’s technology.

HTAA’s role as the primary distributor emphasizes its commitment to bringing the best-in-class solutions to the market. While other companies may have technical partnerships, Hanwha’s agreement with Neotel is focused on delivering both sales and service, ensuring a seamless experience for customers looking to integrate Neotel’s products into their operations.

More information is available at www.hanwha-pm.com