caLogo

Press Releases

CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies. This innovative process significantly increases production yields while reducing the production cycle time for each assembly. NEOTech remains committed to continuous improvements, particularly in the manufacturing of extraordinarily high-tech microelectronics products for the nation’s leading OEMs in the Aerospace & Defense, Medical Device, and Industrial markets. As part of this commitment, NEOTech has researched, tested, and qualified an advanced wire bonding technique known as Standoff Stitch (SOS), which further reinforces the company’s dedication to delivering high-quality, precision-driven solutions.

NEOTech, already recognized as an industry leader in SMT electronics manufacturing, stands at the forefront of high-tech microelectronics circuit assembly as well. The company’s original first- pass yields for wire bond and bond pull test processes were already excellent, achieving a 99.3% success rate. However, for mission-critical electronics used in aerospace, defense, space, and medical implantable device applications, even this high yield rate required further improvement. Common methods to enhance wire bond yield and reliability, such as the Burnishing process and the Security Bonding process, have been effective but significantly increase production time. To address this challenge, NEOTech has researched and implemented the SOS wire bond process, which not only boosts reliability but also reduces the production cycle time, offering a more efficient solution without compromising quality.

The SOS wire bond process is a superior method for ensuring high-quality interconnects of micro fine wires to the conductive pads on the substrate surface, which are often uneven or wavy due to the screen-printing process. When standard wire bonding methods are applied to these uneven surfaces, poor bond adherence can result, impacting overall quality. The SOS process addresses this issue by incorporating a gold ball approximately 2.5 mil in diameter during the first step of the wire bonding process. This gold ball accommodates the uneven surfaces without the need for additional steps, significantly reducing production time for each assembly. Furthermore, the increased surface area at the substrate bond interface created by the gold ball forms a more robust bond, enhancing reliability. NEOTech has seen remarkable improvements from this method, with production yields increasing to 99.99% and throughput doubling.

Jim Doyle, Chief Executive Officer of NEOTech’s Aerospace & Defense Business, expressed his enthusiasm for the recent advancements, stating, “At NEOTech, we are dedicated to fostering a culture of continuous improvement to ensure we consistently deliver the highest quality products to our customers. The implementation of the SOS wire bonding process is a testament to our commitment to innovation and operational excellence. By enhancing our wire bonding capabilities, we not only improve production efficiency but also ensure the reliability and performance of mission-critical microelectronics for the aerospace, defense, medical, and industrial sectors. We are proud of our team’s unwavering focus on quality and their efforts to push the boundaries of what’s possible in electronics manufacturing.”

NEOTech distinguishes itself through its broad capabilities and exceptional service offerings, serving industries such as aerospace/defense, medical devices, industrial, and high-tech sectors. Renowned for delivering high-quality products and solutions, NEOTech has become a trusted partner for complex, mission-critical electronic manufacturing projects. The company’s cutting-edge facilities and advanced manufacturing technologies guarantee precision and reliability in every product. NEOTech’s commitment to quality is evident through its adherence to stringent standards, backed by certifications like ISO 9001:2015, ISO 13485:2016, and AS9100. At the core of NEOTech’s success is its customer-centric approach. Offering a comprehensive suite of services — from design and prototyping to full-scale production and post-production support — NEOTech tailors its solutions to meet each customer’s specific needs. The company’s ability to provide personalized solutions, while also reducing time-to-market and optimizing costs, has earned it a strong reputation for delivering exceptional value.

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the aerospace/defense industry, medical products, and high-tech industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech’s Microelectronics manufacturing capabilities, please visit www.NEOTech.com/microelectronics 

STEINACH, SWITZERLAND – Variosystems AG is reinforcing its Executive Leadership Team with its new Chief Financial Officer (CFO), Markus Nikles, an international finance specialist with industry experience. After expanding the leadership this year to include Stefan Hasenfratz, responsible for business development in Asia, and Anthony Pugliese, Head of the North America Region, Variosystems is finishing the reinforcement of its Executive Leadership Team by appointing Markus Nikles as CFO.

Variosystems is a global service partner for all-inclusive electronics solutions with customer organizations in Europe, North America, the Asia-Pacific region, and China. The company, based in Steinach, Switzerland, is on a growth trajectory and expanding in all regions, with an aim of doubling its revenues by 2026. Variosystems is drawing on international management expertise to achieve this.

Since the start of the year, Stefan Hasenfratz (Head of Variosystems Asia) and Anthony Pugliese (Head of Variosystems North America) have been reinforcement for the Executive Leadership Team consisting of CEO Stephan Sonderegger, COO Stefan Walther, CHRO Christine Peter, CIO André Bättig, and cofounder Norbert Bachstein. With the appointment of CFO Markus Nikles as of October 1, 2024, the team is now complete. The finance expert, who comes from Interlaken, Switzerland, and is experienced in the stock markets, succeeds Raymund Scheffrahn, who left the company at his own request at the end of July.

“We want to be the most trusted and sustainable electronics service partner, including on a global scale. With the reinforcement provided by Markus Nikles, we are working toward this objective. He contributes long-standing international experience in financial management at major industrial enterprises and has spent many years in positions in the United States and China. These markets are strategically important for our growth,” says Stephan Sonderegger, CEO of Variosystems. The new CFO, Markus Nikles, is looking forward to his duties: “Variosystems is one of Switzerland’s best-managed companies and has a clear vision and strategy. This is just as inspiring as it is motivating. Contributing my expertise, I wish to have a hand in achieving the ambitious goals.”

Financial expertise for global growth

Markus Nikles was most recently CFO at Meyer Burger Technology AG and, before that, spent 22 years in leadership positions for the Bühler Group, including ten years in the United States and three in China. With a degree in business and an executive master’s in corporate finance, he is based at Variosystems’ head office in Steinach and reports directly to the CEO.

NEUSS, GERMANY – Yamaha Robotics announced today that the Company has held a ceremony to celebrate the completion of renovation and expansion work at the Hamamatsu Robotics Office, which develops, manufactures, and sells surface mounters and industrial robots, as well as the 40th anniversary of the Robotics Business, which started in 1984 as the IM Division. The ceremony was attended by approximately 200 people, including business partners, and included a ribbon-cutting by President and Representative Director Yoshihiro Hidaka.

The renovation and expansion work began in January 2023, achieving 1.6 times increase in the total floor area of the office buildings and 1.8 times expansion in production area. As a result, the production capacity for surface mounters will be approximately doubled.

Additionally, with the installation of additional solar panels in the expanded area, the conversion of the entire facility, including the cafeteria, to electric power, and the introduction of CO2-free electricity starting in 2022, this will be the Company’s first Carbon Neutral Factory.

The strengthening of the base through this expansion and renovation is part of the company's strategic investment in growing businesses under its medium-term management plan (2022-2024). Yamaha Motor will further enhance its customer- oriented systems for technology, sales, and services, which is the strength of its robotics business, and work towards reinforcing profitability by expanding the scale and business area in a growing market.

NAMPA, ID – Silicon Mountain, a leader in electronics manufacturing, is thrilled to announce its participation as an exhibitor at TECHSPO Phoenix & DigiMarCon Southwest 2024, taking place October 24-25, 2024, at the Hilton Scottsdale Resort, Phoenix, AZ. This prestigious event is a unique opportunity for Silicon Mountain to showcase its advanced manufacturing solutions alongside cutting-edge digital marketing, media, and advertising technologies.

Silicon Mountain will highlight its comprehensive electronics manufacturing services, including its recent initiatives to secure International Traffic in Arms Regulations (ITAR) registration. This significant move positions the company as a key player in the defense and aerospace sectors, ensuring compliance with stringent U.S. government regulations.

“As we prepare for ITAR registration, we are excited to present our expanded capabilities at TECHSPO Phoenix & DigiMarCon Southwest,” said Kris Townsend, General Manager and Owner of Silicon Mountain. “This event is the perfect platform to engage with industry leaders and showcase our innovative manufacturing solutions, which are now equipped to meet the needs of highly regulated sectors.”

Attendees visiting Silicon Mountain’s exhibit will learn about the company’s ITAR preparation and its commitment to advancing manufacturing solutions through secure and compliant processes. In collaboration with local partners CETEC and Agama Labs, Silicon Mountain is enhancing its security protocols, personnel training, and data management practices to meet ITAR standards, driving innovation in the national defense sector.

DigiMarCon Southwest 2024 provides an unparalleled opportunity to network with thought leaders, collaborate with peers, and gain insights into emerging digital strategies and technologies. With topics ranging from Artificial Intelligence to Programmatic Advertising, attendees will leave equipped with actionable insights to thrive in a rapidly evolving digital world.

For more information on Silicon Mountain’s advanced capabilities and services, visit www.siliconmtn.net 

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic. AIM’s Ales Sedlak will be giving a presentation titled “Addressing Concerns of Ultra-Miniature Component Assembly: M0201, 008005, and Micro/MiniLEDs.”

Presentation abstract: The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss the new information on how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.

Among other great products, AIM will also be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste at this event. AIM’s NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at SMT-Info October 15-16, or visit www.aimsolder.com 

MANASSAS, VA – ZESTRON, the global leader in high- precision cleaning products, services, and training solutions for the electronics manufacturing industry, is excited to announce its upcoming webinar, "Electrifying Reliability: Advanced Cleaning and Coating Solutions for Enhanced Performance in E-Mobility," which will take place on October 17, 2024, at 2:00 PM EDT.

As the future of transportation moves toward electrification, ensuring the reliability of electronic components in the rapidly growing E-Mobility sector is more critical than ever. This webinar will bring together industry experts Jeff Kennedy from ZESTRON Academy and Brent Frizzell from Specialty Coating Systems to discuss the latest cleaning and coating technology advancements that enhance performance and reliability.

The session will give attendees an in-depth look at cleaning and coating solutions to mitigate common failure causes in E-Mobility applications such as electrochemical migration (ECM) and creep corrosion. As electric vehicles (EVs) and other e-mobility innovations push the boundaries of performance, maintaining the integrity of electronic components is essential to ensuring their long-term success. This is a must-attend event for engineers, manufacturers, and industry professionals who want to stay at the forefront of E-Mobility innovations and ensure the long-term reliability of their electronic systems.

Don't miss this opportunity to learn from the experts and stay ahead in the electrified future of transportation.

Register For The Webinar: https://pages.zestron.com/2024-electrifying-reliability-advanced-cleaning-and-coating-solutions-for-enhanced-performance-in-e-mobility  

Page 96 of 1266

Don't have an account yet? Register Now!

Sign in to your account