CYPRESS, CA – Hanwha Techwin Automation Americas, Hanwha Precision Machinery’s North America branch office, and a leader in precision manufacturing and technology solutions, is excited to announce the appointment of Circuit Assembly Products SE, represented by Doug Eidle, as its new representative for Georgia, Alabama, Mississippi, and Tennessee.
Doug Eidle, a seasoned professional with extensive expertise in PCBA and microelectronics packaging, will represent Hanwha’s cutting-edge capital equipment for SMT, thru-hole and advanced packaging technologies. With a robust track record in B2B strategies and customer relationship management, Doug is uniquely qualified to enhance Hanwha's presence in the Southeastern United States.
Tim Kang, CEO of Hanwha Techwin Automation Americas, expressed his enthusiasm about the new partnership, stating, "We are thrilled to welcome Doug Eidle and Circuit Assembly Products SE to our team. Doug’s deep understanding of the market and demonstrated ability to connect with customers and coordinate sales and service efforts make him the ideal partner to help us expand our reach in the Southeast. His expertise will be invaluable as we continue to introduce innovative solutions to meet the evolving needs of the electronics manufacturing industry."
Doug Eidle’s role will focus on promoting Hanwha’s state-of-the-art technology solutions, facilitating new customer engagements, and ensuring that clients receive exceptional support and service. This partnership is expected to strengthen Hanwha’s market position and help in achieving sustained growth in the region.
More information is available at www.hanwha-pm.com
HAVERHILL, MA – Seica, Inc. is pleased to announce its participation in SMTA Guadalajara, scheduled for Sept. 11-12, 2024 the Expo Guadalajara, Salón Jalisco Hall D & E in Mexico. Visitors can find Seica at Booth 957, where the company will showcase the innovative PILOT V8 Next> series, a technological breakthrough in double-sided flying probe testing.
The PILOT V8 Next series presents a significant advancement in double-sided flying probe testing, effectively addressing the inherent limitations of horizontal systems. Its vertical architecture is an optimal solution for probing both sides of the Unit Under Test (UUT) simultaneously. This design enhances test throughput and flexibility, ensuring fast, precise, reliable and repeatable probing. The system also offers full availability of all mobile resources for testing the UUT, making it a versatile and powerful tool for various testing needs.
Seica's PILOT V8 Next series boasts an impressive range of test performances, including In- Circuit test, Functional test, Power on functional test, and OTPN (One Touch Per Net) with Fnode for detecting shorts, opens and Nodal Impedance. Additionally, it supports OPENFIX, On-Board Programming, Boundary Scan, Thermal Test, LED Test, and LASER warpage compensation.
The PILOT V8 Next series is designed to meet the rigorous demands of modern electronic testing, providing remarkable accuracy and efficiency. Its ability to perform comprehensive tests, from In-Circuit to power-on Functional tests makes it an invaluable asset for manufacturers aiming to ensure the highest quality and reliability of their electronic products. Ergonomic manual loading gives maximum flexibility for small or medium size production runs, and an optimum price/performance ratio makes the Pilot V8 a great economic choice as well.
Seica invites all SMTA Guadalajara attendees to visit Booth 957 to learn more about the PILOT V8 Next> series and see live demonstrations of its capabilities. The Seica team will be on hand to provide detailed information and answer any questions about how this advanced testing solution can enhance your production processes.
To learn more about Seica’s PILOT V8 NEXT flying probe tester, visit www.seica.com
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Productronica India taking place September 11-13 at India Exposition Mart Limited (IEML), Greater Noida, Delhi. Among other great products, AIM will highlight their newest halogen-free no clean solder paste, H10.
H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM’s brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.
H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.
To discover all of AIM’s products and services, visit the company at the Productronica India taking place September 11-13th at booth H15 F67, or visit www.aimsolder.com
SHINGLE SPRINGS, CA – PDR Americas is proud to announce the appointment of Matt Osborne of REStronics Mid-Atlantic as its new representative for North and South Carolina. This strategic partnership will enhance the company’s support for electronics manufacturers in these regions.
PDR is renowned for its state-of-the-art rework systems and X-ray technology, which enable manufacturers to achieve reliable and efficient assembly processes while ensuring the highest quality standards. These solutions are designed to meet the demanding requirements of the electronics manufacturing industry, offering precise and effective tools for rework and inspection.
Matt Osborne brings extensive experience and expertise in the electronics industry. Beginning his career in the early 80’s, Matt worked for his mother, who was a Vice President of a large contract manufacturer in Delaware. With a rich history in electronics manufacturing, Matt's family roots trace back to his grandmother, who made capacitors for Sprague Electric. His journey in the industry has seen him take on various roles, from SMT manufacturing engineer at Motorola to field service engineer at Quad Systems, and later design engineering for Decatur Radar.
“We are thrilled to welcome Matt Osborne to the PDR team,” said Dave White, CEO of White Industrial Corporation, parent company of PDR Americas. “His deep understanding of the electronics industry, coupled with his extensive experience and commitment to customer satisfaction, make him an ideal representative for our advanced rework and X-ray solutions. We are confident that Matt will provide excellent support to our customers in North and South Carolina.”
Matt Osborne expressed his enthusiasm about the new partnership, stating, “I am not a sales guy! I am a problem-solving solution provider. I am excited to represent PDR and their innovative rework and X-ray technology in North and South Carolina. I look forward to working closely with electronics manufacturers in the region to help them achieve their production and quality goals with PDR’s state- of-the-art solutions.”
For more information about PDR Rework and its innovative solutions, please visit www.pdr-rework.com
PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce that our Sales Channel Partner (SCP), Bergen Group India, will showcase ViTrox’s latest SMT PCB Assembly Solutions at India Exposition Mart Limited (IEML), Greater Noida, Delhi NCR, Hall 15, Booth #E31 from 11 to 13 September 2024.
Productronica India serves as a premier platform for exhibitors to present state-of-the-art technologies, making it the perfect venue for unveiling our award-winning V510i Advanced 3D Optical Inspection (AOI) Solution.
ViTrox's V510i 3D AOI Solution is equipped with Artificial Intelligence (A.I.) Smart Technologies. Our A.I. Smart Programming significantly reduces human dependency, dramatically speeds up programming, and ensures exceptional quality, accuracy, and consistency in inspections. Users can experience up to an 80% reduction in programming time, leading to higher yields.
Additionally, the A.I. Assisted Defect Review (A.I. VVTS) automates the buy-off processes in repair stations, delivering over 90% judgement accuracy. This technology also achieves approximately 60% labour reduction, minimises human error by 70%, and cuts associated costs. Our V510i 3D AOI Solution has also successfully met the standards for the IPC-CFX- 2591 Qualified Products Listing (QPL) and has received the necessary IPC-CFX messages for classification.
Additionally, ViTrox is introducing the V510i R Advanced Optical Inspection (AOI) system, poised to transform inspection processes in PCB assembly, particularly for conformal coating and final assembly. The V510i R system features a state-of-the-art vision module mounted on a 6-axis robotic arm, providing flexible multi-angle viewing inspections. This innovative design allows the V510i R system to inspect hard-to-reach areas and partially hidden components, ensuring comprehensive defect detection that surpasses conventional AOI systems. By automating the inspection process, the V510i R system significantly reduces dependence on manual human inspection, enhances accuracy, and enhances production throughput.
Furthermore, our technical experts will be present to provide insights into our latest innovations and advancements. They will be available to discuss the full solutions, ranging from V310i Advanced 3D Solder Paste Inspection (SPI), V510i Advanced 3D Optical Inspection (AOI), V810i Advanced 3D X-ray Inspection (AXI), V9i Advanced Robotic Vision (ARV) and Industry 4.0 Manufacturing Intelligence Solutions (V-ONE) in detail, demonstrating the capabilities and how these solutions can revolutionise production processes.
Don’t let manufacturing challenges hinder your progress! ViTrox experts will be on hand to answer your questions and provide live demonstrations of our products. Schedule your preferred appointment time via the registration link to meet with our field experts in person. For more information about our solutions, contact us at enquiry@vitrox.com
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at NEPCON Vietnam September 11-13th at booth U05, or visit www.aimsolder.com