Circuits Assembly Online Magazine - Current

Press Releases

Hamburg, March 21st, 2019: YXLON International, a division of the Swiss Comet Group, have today announced a collaboration with the Japanese company Nagoya Electric Works (NEW). The collaboration includes the development and distribution of specialized X-ray systems for the semiconductor industry.

David Grushow has joined Z-AXIS as a manufacturing engineer in the company’s electronic contract manufacturing services group near Rochester, NY.

Manassas, VA – March 20, 2019 ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will be featuring its leading cleaning technologies HYDRON®, MPC®, and FAST® at the SMTA Intermountain (Boise) Expo.

Milford, NH – Wednesday, March 20, 2019

Summary:
Cirtronics, an advanced contract manufacturing firm in Milford, NH, congratulates FIRST Robotics Team #1519, Mechanical Mayhem, on their success at the Granite State District Event, first competition of the season.

Terrell, Texas, USA -- Conecsus, LLC, an innovative environmental technology and recycling company, will exhibit at the SMTA Expo and Tech Forum Chihuahua Edition, Wednesday, May 8, 2019 beginning at 09:00 am. The venue is Salon Villarreal, Colegio, Lomas del Valle, Chihuahua, Chih., Mexico. More information is available at https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=120.

Irvine California, USA – TopLine will exhibit a range of CCGA PCBA assembly solutions at NEPCON China Shanghai, in Stand #1F04, April 24 – 26. This will be TopLine’s 6th straight year at NEPCON China Shanghai. Featured products will include CCGA - Column Grid Arrays and Daisy Chain BGA test vehicles. TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. “Many people are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board,” states Martin Hart, TopLine CEO. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html.