Circuits Assembly Online Magazine - Current

Press Releases

PROMATION Inc. – a Wisconsin based corporation - is celebrating its 20th year anniversary serving the electronics manufacturing sectors. Gary Goldberg (Founder) began manufacturing high quality PCB handling systems with continual investments made in “next generation technologies”. Today the company offers a wide range of manufacturing technologies, including: Laser Marking, Label Placement, PCB Routing, and Robotic soldering systems; all of which feature a great front-end software interface.

"Solder Mask and Low Standoff Component Cleaning – A Connection?"

Mr. Markus Jeck has been appointed new General Manager of Enics Switzerland as of February 1st 2020.

Mycronic AB (publ) has grown substantially during the last years, both organically and through acquisitions. In order to prepare for continued profitable growth, a new group structure is implemented in order to achieve the strategic priorities of improving profitability in Assembly Solutions, securing and expanding the position in Pattern Generators and enhancing customer centricity. The new Mycronic organization will be made up of four divisions:

Elk Grove Village, Illinois, USA – 08 January 2020 – Pillarhouse USA Inc. today announced: Global manufacturer and supplier of selective soldering systems, Pillarhouse USA, Inc. is pleased to announce the appointment of EAP, to spearhead sales efforts in Florida. Adrian De’Ath, Vice president for Pillarhouse USA Inc stated’ we are thrilled to announce EAP have joined the Pillarhouse sales team, they bring years of sales experience to the table with a comprehensive background in electronics manufacturing, materials, process knowledge.

NORTH YORK, ON / ACCESSWIRE / January 22, 2020 / ZTEST Electronics Inc. ("ZTEST" or the "Company") (CSE:ZTE) is pleased to announce that it is proceeding with a non-brokered private placement (the "Offering") for the sale of up to 2,000,000 working capital units ("WC Units") at $0.15 per WC Unit for proceeds of up to $300,000. The Company also wishes to announce that it has entered into agreements to settle an aggregate of $153,500 of debt owed to insiders of the Company for management fees and directors fees in consideration for the issuance of 1,023,000 common shares of the Company at a price of $0.15 per share (the "Debt Settlement").