Press Releases
AUSTIN -- TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS® versions. New high-end product examples using fan-out on substrate are discussed. Features of the build-up substrates supporting redistribution layer (RDL) structures are provided. Applications for high-performance wafer-to-wafer hybrid bonding are also described. Trends in integrated photonics packaging are discussed, including the use of fan-out options.
The report includes OSAT financials and examines economic trends impacting the industry. The past two years saw phenomenal growth in shipments of smartphones and PCs. Reduced demand for smartphones and PCs this year is changing package demand. High-performance and mid-range Samsung smartphones are examined to determine package usage.
TechSearch International analyzes changes in the gap between manufacturing demand and capacity for build-up substrates. Lower demand for PCs is easing the shortage this year, but demand continues to increase for the more complex, more expensive FC-BGA substrates. Examples of substrate features are included. IC package substrate design rules for major suppliers are provided in the report.
The latest Advanced Packaging Update is an 89-page report with full references and an accompanying set of 43 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 22,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com.
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PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Germantown, WI—July 2022—WAGO has hired Jeffrey Govek its new Senior Sales and Application Engineer. After receiving his degree in Electrical Engineering from the University of Tulsa, he got his MBA from Methodist University. Govek, now based in the Dallas area, has worked in the oil and gas, printing and IoT industries. He also ran his own automation consulting company for many years prior to joining WAGO. “As a prior customer of WAGO and automation products, I feel that I can help demonstrate the value that WAGO brings to existing and future customers,” says Govek. “I’m excited to be at a growing company with great products and great people.”
For the latest news from WAGO, visit www.wago.com/us/press-contact
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Indium Corporation’s Anson Yu, regional sales manager for Eastern and Northern China, will present on the company’s diverse portfolio of soldering solutions for the MiniLED market at the Mini LED Backlight Mass Production and Application Trend Conference, Thursday, July 28 in Shenzhen, China.
In Indium Corporation’s MiniLED Welding Solutions, Yu will discuss the company’s variety of materials solutions for MiniLED applications, ranging from water-wash, no-clean, and solvent-clean products and solutions, including pastes, alloys, flux, and tacky fluxes. These solutions include Indium Corporation’s new NC-38HF LED solder paste, which can be used with Type 6 to Type 8 powders, so customers can choose the best fit for their applications amid the ongoing chip miniaturization trend of LEDs, which demand new printability and solderability requirements.
Yu has more than 10 years of manufacturing and equipment engineering experience. He earned his bachelor’s degree in electrical engineering from Nanjing Institute of Technology and his master’s degree in business administration from Wuhan University. He has earned a Flextronics global automation certification and is a certified Flextronics Lean Green Belt as well as business unit six sigma mentor.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
NASHVILLE — July 2022 — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Wednesday, August 24, 2022 at the Best Western Plus Strongsville. The KYZEN team will showcase the first and only concentration monitoring and control system in the world, the KYZEN Process Control System (PCS), and the newest addition to the award-winning AQUANOX product line: AQUANOX A4626.
The environmentally friendly AQUANOX A4626 removes all of the latest as well as traditional flux residues. It has a long tank life and is safe for multi-pass applications.
The next-generation cleaning chemistry is designed to quickly remove the latest polymeric no-clean flux residues, while providing superior results on traditional lead-free and eutectic tin-lead residues as well.
For world-class process control, the KYZEN PCS monitors and automatically reacts to the dynamic changes in the wash bath concentration. More than 20 years ago, KYZEN PCS was designed to maximize high-quality output from inline cleaning systems, and its capabilities have continuously improved and advanced.
Today, it remains the only complete concentration monitoring and control system available in the world. The latest KYZEN PCS features improved control algorithms and a new, 7” color touchscreen interface.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst will complete the optimization and provide you with a worry-free process.
For more information, visit www.kyzen.com.
About KYZEN
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Bittele Electronics Inc., a Toronto-based PCB manufacturer specializing in prototype and small-to-mid volume printed circuit board assembly, announced the expansion of its Markham, Ontario, PCB assembly facility. Bittele has expanded its component warehouse to provide more storage space for consigned inventory since extended part lead times still plague the component market.
“With the expanded warehouse, we can store consigned parts for ongoing and upcoming orders,” says Ben Yang, CEO of Bittele Electronics. “We also offer the option of purchasing and stocking critical items from a customer’s BOM upon request.”
In addition to the expansion of its component warehouse, Bittele has also installed a new Soltec wave soldering machine, which will be utilized for larger-volume, through-hole assembly. The new wave soldering machine will complement its current Ersa selective soldering machine and will be operational later this summer.
Bittele’s Markham facility offers quick-turn prototype to mid-volume production focusing on its North American customers and features fully automated printed circuit board (PCB) loading, solder paste printing, component placement, reflow and inspection.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
Since partnering with Heller Industries last year, Altus Group, a leading supplier of capital equipment for the electronics industry, has seen growing interest in the company’s reflow oven technology including its latest innovation, the MK7.
Altus has introduced Heller Industries equipment to a wide variety of customers as it supports all production requirements from entry level NPI volumes, to the fastest throughput needed in automotive environments.
As an innovator in convection reflow and in-line continuous curing applications, Heller Industries MK7 Reflow Oven is one of the world’s best SMT convection reflow oven for high-throughput applications.
Joe Booth, Altus said: “Heller Industries are leaders in their field, having pioneered convection reflow soldering since the 1980s. Because they have many years of in-depth knowledge and understanding of reflow oven technology, we were thrilled to add them to the Altus portfolio. The addition of the MK7 Reflow Oven has enabled us to introduce their technology to even more of our customers because of its game changing benefits and massive energy-based ROI.
“Mk7 is designed with lower Delta T for superior thermal uniformity. It also has reduced nitrogen consumption of up to 40% and a new low height package that makes it easy to see across the production floor. There is also a flux collection system included trapping flux in collection jars that are easily removed and replaced while the oven is still running, so there is no downtime for changes.
“Another important feature is the energy management software. Energy saving is a hot topic at the moment and one which we are often asked about when it comes to new equipment. The MK7 software allows users to optimise energy consumption during the various production times, whether during heavy use or even when idle. With optimal airflow, uniformity and double insulation on all its skins there is at least a 20% energy saving when compared to the MK5 which was already comparable to others in the field.
It is not just software that makes this unit so energy efficient. Heller has modified the design of the heating zones to remove overall mass and reduce the distance from the fans to the product. This means that the oven requires less energy to heat up and less ongoing energy consumption to remain hot. This means that the oven warm up is faster (25%) and the oven is more reactive when reflowing higher thermal mass products, which helps keep the internal zone temperatures as uniform as possible to their set temperatures and in doing so, increases profile accuracy.
PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com
