MUNICH — J.A.M.E.S (Jetted Additively Manufactured Electronics Sources), the authoritative leader in advancing the development of AME, announced today the giveaway of the most innovative software in electromagnetic (EM) and electronics simulation.

The company is offering the opportunity to get the CST Studio Suite on the 3DEXPERIENCE Platform created by Dassault Systèmes. The main goal is to empower enthusiasts and professionals from industry as well as academia who are passionate about designing and manufacturing 3D printed electronics.

CST Studio Suite is a high-performance EM and Multiphysics simulation software package that helps to analyze, design, and optimize electromagnetic components and systems. Moreover, it offers a holistic view of the product and market advantages, facilitating shorter development cycles and reducing costs. The software is well-known and used by many leading companies in the high-tech, transportation and mobility, aerospace and defense, and energy industries to evaluate all types of EM effects during electronic system design processes.

“We believe many talented designers and engineers want to manufacture and bring 3D printed electronics to the next level. Collaborating with Dassault Systèmes help us to ensure value creation in the AME community that we are building,” said Andreas Müller, CEO of J.A.M.E.S. “More importantly, it is part of our ongoing mission to make AME usable and accessible for the whole industry.”

Shared Expertise, Shared Experiences

J.A.M.E.S uses CST Studio Suite for designing 3D printed electronics and creating structures containing full 3D wiring. Its engineering team simulated passive RF components as well as capacitors and coils by using CST Studio Suite. More importantly, it allows them to optimize the existing structures for printing with the DF IV and designing in 3-dimensional form factor. The CST Studio is one of the first software programs that enables electrical engineers to combine mCAD and eCAD.

Details of the Giveaway

The registration period is from October 27th, 2022 until December 6th, 2022. There are ten prizes:

• 1x One-year license
• 3x Half-year license
• 6x Three-month license

Additionally, professional training will be provided to all winners.

To take part in this giveaway, the participants are required to:

1. Sign up at the J.A.M.E.S platform www.j-ames.com

2. Share on LinkedIn your choice of the AME story or design (https://j-ames.com/AMEHub) and tag J.A.M.E.S

3. Follow J.A.M.E.S on LinkedIn

The winner announcement will take place in December 2022. More information can be found at www.j-ames.com/Community/Events

CHICAGO — IDENTCO is pleased to announce plans to exhibit at the SMTA Electronics Manufacturing Conference and Expo at the Minneapolis Convention Center, November 2-3, 2022, in Minneapolis, Minnesota. The IDENTCO team will showcase its complete range of electronics labeling solutions in Booth 919.

IDENTCO’s labeling and high temperature masking system enables customers with SMT lines to print on-demand miniature tracking labels and automatically apply those labels to their printed circuit boards and components using existing pick-and-place assets. A pre-printed label option also is available through IDENTCO’s Print Service Centers in the US, Germany and Mexico. Additionally, the system can be used to automatically place high temperature die cut polyimide masks for selective solder masking.

IDENTCO offers the thinnest pick-and-place label presenter in the industry that is compatible with all major pick-and-place machines and saves valuable space in the pick-and-place machine. High performance labels and matching ribbons withstand the extreme temperatures and solvents used in the manufacture of surface- mount and through-hole printed circuit boards, providing traceability throughout the entire assembly process. Labels also are available with electro-static dissipative (ESD) properties to meet the requirements of ANSI/ESD S20.20.

Visit IDENTCO at the SMTA Electronics Manufacturing Conference and Expo Booth 919 to see the complete SMT label automation system in action. IDENTCO delivers the total solution with our superior micro-miniature labels, label feeders, printers, ribbons, and support.

CZECH REPUBLIC – PBT Works s.r.o., a leading manufacturer of cleaning technology for electronic assemblies and tooling, is pleased to announce that Trylene, Inc. has purchased a SuperSWASH III. The sale was liaised by Mike Gunderson of MaRC Technologies. Based in Houston, Texas, Trylene is an onshore electronic manufacturing service (EMS) provider.

Dhruv Patel, VP at Trylene, commented, “Technology, speed and reliability are critical to success in the electronic industry. We are well equipped with state-of-the-art advanced automated SMT manufacturing lines to deliver the speed and reliability that our customers expect, and the PBT Works SuperSWASH III has been a major contributor in achieving this. At Trylene, we implement the mantra that the key to success is through continuous improvement, and we achieve this through constant personnel training, equipment upgradation and process improvisations.

Trylene provides a range of services from concept to quick prototype manufacturing all the way to full- scale production. We are flexible in volume, assembly, and processes to support today’s complexity in manufacturing. The company was established with the motive of providing complete customer satisfaction to its customers.

Trylene’s goal is achieved by implementing the latest technologies, equipment and methodologies that ensure the best quality products are delivered on-time at the most competitive price. This makes Trylene a one-stop destination for customers looking for contact manufacturing services performed locally at a competitive price. Trylene is an ITAR, 9001 & 13485 certified company.

The SuperSWASH III is the ideal fit for Trylene’s high-density SMD assemblies because it is designed for customers looking for the best cleaning results without the need for automation or very high throughput. The system is ideal for medium to low quantities of complex products that need to be cleaned perfectly.​

For more information about Trylene, visit http://trylene.com/

PBT Works is EN ISO 9001 and EN ISO 14001 certified. For more information, visit www.pbt-works.com

CLINTON, NY — Indium Corporation will be showcasing its innovative products and technology throughout the China market at five industry tradeshows in October and November. The award-winning materials solutions featured at these shows will include soldering products for high-reliability, solutions for heterogeneous integration and assembly (HIA) and system-in-package (SiP), and LED applications.

CEIA Changsha, November 11

Indium Corporation will feature its award-winning material solutions for high reliability.

• Durafuse™ LT is a novel mixed alloy system with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients.
• Indium8.9HF Solder Paste is a no-clean, halogen-free paste with superior printing and voiding performance. Indium8.9HF offers low bottom termination component (BTC) voiding, enhanced post-reflow flux residue electrical reliability, and a strong oxidation barrier which promotes complete coalescence and HIP resistance.

SiP China Shenzhen, November 5–7

Indium Corporation will feature its innovative materials solutions for HIA and fine-pitch system- SiP applications.

• SiPaste® ultrafine-pitch solder paste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 7. They help Avoid the Void®, reduce slumps, and demonstrate consistent superior printing performance. SiPaste® C201HF is specifically formulated to accommodate fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields.
• NC-809, the first low-residue no-clean, ball-attach flux on the market. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.

MiniLED Shenzhen, November 10–11

Indium Corporation will feature its wide range of products for the current and evolving needs of LED manufacturing.

• LEDPaste NC38HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, especially for mini- or micro-LED applications. It combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for the smallest LED applications. It also delivers high tackiness and is available in a wide range of alloys, including Ag-free options.
• Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Formulated with Indium Corporation’s Type 6 SGS powder, it is ideal for fine feature printing applications and also offers consistent, repeatable printing performance combined with a long stencil life. Indium Corporation will feature halogen-free, ultra-low residue, no-clean flux NC-809 and water washable flux WS-829. Both fluxes are formulated with high tackiness and designed for printing and pin transfer applications for high-density mini-/micro-LED die-attach applications.

China Semiconductor Packaging Test Technology & Marketing Annual Conference (CSPT), November 14–16

Indium Corporation will again feature its innovative materials solutions for HIA along with its portfolio of high-reliability solutions for power electronics.

• InFORMS®, reinforced solder alloy fabrications, improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• InTACK™ is a halogen-free adhesive specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the need for fixturing during assembly for a lower cost of manufacturing ownership. It is uniquely designed for clean flux-free reflow processes, maintaining high tack strength to hold materials in place without residues or the need for extra cleaning steps in the process.