Press Releases
CAMBRIDGE, UK — How can advanced functional materials such as conductive inks be developed more quickly? Anyone who has spent time in a laboratory knows that material development can be a laborious process. By utilizing an AI platform to optimize experimental parameter selection and reduce the number of iterative steps, materials informatics promises much more efficient material development pathways.
In a recent press release, particle-free conductive ink company Electroninks announced a partnership with material informatics company Citrine to develop a new conductive ink with reduced resistivity (3.2 µohm cm-1) and curing temperature (80°C). This is a more desirable set of properties than existing materials and should facilitate adoption for printed electronics and especially electromagnetic (EMI) shielding. The collaboration clearly illustrates the benefits that material informatics (MI) can provide to expedite improvements in the properties of pre-existing materials with clear industrial applications.
What Is Particle Free Conductive Ink?
Conductive inks are a longstanding technology that underpins printed electronics. Conventional conductive inks comprise micron-scale metal flakes suspended in a solvent with polymeric binders and are widely used in applications ranging from solar panel busbars to printed/flexible sensors.
In contrast, as the name suggests, particle-free conductive inks do not contain any metal particles. Instead, a transparent solution of solvated metal salt is chemically converted in situ to produce a metal. The chemical reaction is induced by heat, light, or plasma, resulting in a smooth conductive metal layer. This particle approach brings three main advantages: high conductivity, low viscosity, and a smooth surface.
What Is Materials Informatics?
Material informatics describes the utilization of data-driven methods, including machine learning, in materials R&D. It can help design new materials or select the right material for a given application, optimize material processing, and more. While this can take various forms, including literature/patent analysis and sourcing data via computational chemistry, one approach (and that used to develop particle-free inks) is to facilitate experimental design and parameter selection via supervised learning algorithms.
MI can accelerate the 'forward' direction of innovation (properties are realized for an input material), but the idealized solution is to enable the 'inverse' direction (materials are designed given desired properties). If integrated correctly, MI will become a set of enabling technologies accelerating scientists' R&D processes while making use of their domain expertise.
Compelling Advantages
Particle-free inks typically have higher conductivities than their more conventional particle-based counterparts. Since the metal is formed in situ, and the proportion of binder materials can be very low, conductivity can be as high as 80% of the bulk metal. This, of course, means that less ink can be used, with the additional benefit of there being less solvent to evaporate away during curing.
The low viscosity of particle-free conductive inks reduces the risk of nozzle clogging, making them ideally suited to aerosol and electrohydrodynamic (EHD) printing. Both of these techniques have nozzles with very small apertures and are capable of printing at lines as thin as 10 and 1 um, respectively. Depositing lines this narrow enables printed electronics to compete with subtractive methods such as photolithography and thus be used for semiconductor packaging.
Additionally, the smooth surface produced by particle-free conductive inks makes them highly desirable for radio frequency (RF) applications since, as signal frequency increases, surface roughness rather than bulk conductivity increasingly dominates impedance.
Key Questions Answered
If you would like to learn more about the opportunities enabled by the many types of conductive inks and material informatics, IDTechEx offers comprehensive and recently updated market research reports on both fields. These draw on company interviews and conference attendance to provide market forecasts, technology analysis, player profiles, investment details, roadmaps, company lists, and more, giving a clear picture of the technological and commercial landscape. To find out more about IDTechEx's technical and commercial analysis across a wide range of emerging technologies, please contact research@IDTechEx.com
DURYEA, PA ― SMT Tooling, a division of PSA Systems, today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The SMT Tooling team looks forward to demonstrating the award-winning Matrix™ Automatic SMT Support Tooling system in Booth #1813.
The Matrix system installs in minutes and includes SMT Tooling’s’ proprietary pneumatic connections for quick and easy product changeover utilizing “Smart Touch” operator interface with on-screen operator instructions and access to PSA downloadable process apps. Features include feather-lite setup force and the most rigid locking force of any system in the industry.
SMT Tooling recognized the need for a more evenly spaced pin pattern when designing the latest version and formed the support modules with a diamond shaped pin pattern that fills in the gaps that contribute to "soft spots" in the support. The Matrix diamond grid pattern is key to a more even support in turn yielding much lower rate of defects like bridging etc.
The new and improved Matrix SMT tooling solution installs on most screen printers and placers in about 30 minutes and offers fully automatic PCB support to each consecutive board.
For more information about PSA Systems, visit www.smttooling.com
SAN DIEGO — EVS International, the leader in solder recovery, is pleased to announce plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The EVS team will showcase the latest innovation in solder recovery in Booth #1100 – the EVS 11KLFHS.
With the newfound price-to-performance ratio in a lead-free version, every user of Waves / Selective solder machines from the thousands of small job shops to the user of one lead and one lead-free units have a compelling reason to invest in the EVS 11KLF solder recovery system and gain pure solder and an impressive return in months not years. The EVS 11 KLF also can help to reduce dedrossing time by 75 percent.
EVS’ new patented technology gives a clean ingot bar as it filters the solder through gauze and the recovery rate is very high achieving up to 80 percent of the solder from the dross. The EVS 11KLF has an 11kilo/24lb pot, touch screen display, and like all EVS systems, is totally automatic.
The system features a totally sealed cabinet, enclosing the dross bucket and fume extraction. The revolutionary Tilting Pot Mechanism allows the engineers to dispense with the space consuming twin opposed air rams and door.
For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com
SAN DIEGO — KIC will exhibit in booth 2401 at the IPC APEX EXPO 2023, taking place January 24-26 at the San Diego Convention Center, San Diego, CA. KIC provides the best and most accurate Heat to DataTM solutions, from the thermal process experts.
A key part of KIC’s solutions is their award- winning customer and application support. KIC, once again, won the 2022 Service Excellence Award in the soldering equipment category. Furthermore, with new technology leveraging their best-in- class profiling systems, KIC won the Mexico EMS Technology Award for their 24 channel profiling capabilities. All of this is added to the industry standard for thermal process inspection: Reflow Process Inspection (RPI) and Wave Process Inspection (WPI).
Be sure to stop by the KIC booth to discuss NPI setup, recipe optimization for reduced defects, improved OEE, oven performance tracking, thermal process inspection, and their complete ecosystem of solutions for thermal processes. And, now with the KIC API available with their software development kit, anybody can integrate KIC automated process inspection with their factory MES or quality systems.
KIC’s 45 years of experience in automated process data collection, KIC service and support offices in every region, and more than 28,000 systems in the field brings the most reliable, accurate, and innovative solutions for electronics manufacturing thermal process challenges. Experts in turning Heat to DataTM. For more information: www.kicthermal.com
DONGGUAN, CHINA ― SASinno Americas today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase the Ant-i1 Offline Selective Soldering Machine will be on display in Booth #1736.
The Ant-i1 includes a drop jet fluxer, bottom preheating zone and optional top preheating zone, and solder pot with 15 kg capacity. It can handle boards up to 350mm L x 260mm W and can manually rotate boards 180 degrees to 700 mm L x 260mm W.
The Ant-i1 software is based on the Windows 10 operating system for easy programming and excellent traceability. Standard features include live on-camera viewing of the soldering process, auto wave height calibration, one-button flux nozzle auto cleaning function, N2 closed-loop heat-up, flux level alarm, solder level alarm and more. Optional features include N2 purity monitoring, N2 flow monitoring, flux quantity monitoring and more.
The SASinno brand stands for “Smart and Steady Innovation.” The company has established a strong worldwide distribution channel with well-trained engineers to support its customers in any location.
For more information about the Ant-i1, watch the video at https://www.youtube.com/watch?v=k-WY5- tHY88
For more information about SASInno Americas, visit www.sasinnoamericas.com
OXFORD, CT — MIRTEC, ‘The Global Leader in Inspection Technology,’ will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
“We are very excited about the products that we will be presenting at APEX 2023,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “MIRTEC will feature a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry.”
MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Series feature our exclusive OMNI-VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-6 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System, an Internal PCB Flipper Conveyor, and Multi-Function AOI/SPI Fusion Technology.
MIRTEC’s Award-Winning MV-3 OMNI Desktop 3D AOI Series features the same hardware and software as MIRTEC’s in-line OMNI-VISION ® 3D Inspection Systems providing 100% compatibility across our entire 3D AOI product line. These systems feature our exclusive OMNI-VISION ® 3D Inspection Technology which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC’s revolutionary 12 Projection BLUE Moiré 3D Technology in a cost-effective platform. MIRTEC’s proprietary Ultra-High resolution CoaXPress Vision System is designed and manufactured by MIRTEC for use with our complete product range of 3D inspection systems. MIRTEC’s 12 Projection Digital BLUE Moiré Technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured MIRTEC’s MV-3 OMNI machines feature four 10MP or 18MP Side-View Cameras in addition to the Top-Down Camera, a Multi-Focus Programmable Z-Axis System and Multi-Function AOI/SPI Fusion Technology. Without question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine ‘On the Planet!’
AI Powered Smart Factory Automation Solution
MIRTEC’s Smart Factory Automation solution, ‘INTELLI- PRO’, is an AI based Software Suite specifically designed for the purpose of improving the performance and convenience of MIRTEC’s complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
MIRTEC’s Award-Winning MS-11e 3D SPI Series feature our exclusive 15MP or 25MP CoaXPress Camera Technology, providing enhanced image quality, superior accuracy, and incredibly fast inspection rates. The MS-11e 3D SPI is also available with a cost-effective 4MP Camera Link option. These machines uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient/excessive solder, shape deformity, shift of deposition and bridging. All MIRTEC 3D SPI machines are CFX complaint and feature upstream and downstream Closed Loop Feedback.
MIRTEC’s Award-Winning GENESYS-PIN Hybrid 3D AOI Series is specifically developed for the Automotive Electronics Market. This extraordinary system is configured with a 12 Megapixel CoaXPress High-speed Camera System, a 15um Precision Telecentric Lens, an advanced nine (9) Phase RGB Color Lighting System, a Programmable Multi-Focus Z-Axis System, and four (4) Programmable Multi-Pattern Digital Projectors which are an integral part of MIRTEC’s proprietary Hybrid 3D Measurement Technology. With this revolutionary optical system, the GENESYS- PIN machine can measure up to 50mm tall connector pins with extreme accuracy. The GENESYS-PIN machine detects defects such as missing pins, pin offset as well as measurement of distance between pins and inner/outer dimensions of forked pins.
New to APEX 2023, MIRTEC will be displaying our GENESYS-CC AI Based Conformal Coating AOI Series. These revolutionary systems are configured with MIRTEC’s Exclusive 15MP CoaxPress Camera Technology, four 18MP Side-Angle Cameras and an optional Internal PCB Flipper Conveyor for Double Sided PCB Inspection. The GENESYS-CC machine inspects for Presence/Absence of Conformal Coating, AI Based Bubble Inspection and Lateral Side Component CC Inspection using the 18MP Side Cameras. The system is also fully capable of standard PCB inspection, providing maximum flexibility to the Electronics Manufacturing Environment.
MIRTEC is Leading the Way to Industry 4.0
MIRTEC’s Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution which combines remote management with real-time data monitoring and analysis for each system within the SMT production line. MIRTEC’s TRMS provides real-time remote monitoring of status information and statistical data such as equipment operation status, production yield, PC resources, temperature, humidity, etc. The combination of MIRTEC’s 3D Inspection Systems and TRMS provide a vast improvement in production process management. The TRMS Module is a key part of MIRTEC’s Intelligent Factory Automation System, INTELLISYS ® . This powerful software suite was designed and developed by MIRTEC to provide manufacturers with a clear view into the manufacturing process, thereby helping them achieve higher operating efficiencies and improved quality.
“IPC APEX has earned a reputation as North America’s largest and most comprehensive Electronics Manufacturing Exhibitions,” continued D’Amico. “We look forward to welcoming visitors to our Booth #1841 for a detailed demonstration of our Award-Winning Inspection Technology”
