Press Releases
WILMINGTON, NC — South-Tek Systems is pleased to announce that it will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The South-Tek team will demonstrate the N 2 GEN® TS, CS and S Series Nitrogen Generators in Booth #2817.
The N2GEN TS The Tank Mounted Skid Series Nitrogen Generator is designed to produce flow rates up to 300 SCFH.
The N2GEN CS The Cabinet Skid Series Nitrogen Generator is designed to produce flow rates up to 2,400 SCFH.
The N 2 GEN S Skid Series of PSA nitrogen generators are designed to produce flow rates up to 35,000 SCFH.
South-Tek’s generators offer purities of 95 percent up to 99.999 percent. All units are custom designed and can be packaged with a dedicated air compressor, dryer and/or booster if needed for a complete turnkey solution. For larger flow rates or redundancy, duplexing options are available.
As one of the largest manufacturers of nitrogen generators, South-Tek is capable of producing custom engineered solutions for all nitrogen applications and specifications. Its nitrogen generation technology safely separates the readily available nitrogen from the air we breathe using Carbon Molecular Sieve (CMS). South-Tek generators create the highest quality nitrogen (filtered beyond the air we breathe), ready for immediate use by any application.
For more information, please visit www.southteksystems.com
CLINTON, NY — Indium Corporation will share a variety of presentations on insightful topics ranging from artificial intelligence, the capabilities of gallium, advanced materials, and more, at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 30-Feb. 2, Kauai, Hawaii, U.S.
Monday, Jan. 30
- The Twin Paradox Explained by Senior Technologist Dr. Ronald Lasky
Tuesday, Jan. 31
- AI and Intelligent Transportation: Perception Versus Reality by Lasky
Wednesday, Feb. 1
- Experimental Analysis of the Effect of Void Area, Void Morphology, and Alloy Composition on the Total Thermal Resistance (Rth) of a Soldered Thermal Interface by Technical Support Engineer Ryan Mayberry
- Gallium: A Versatile Metal with Many Possible Applications by Lasky
Dr. Ronald Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 for his “significant and continuing technical contributions to the SMTA.” He was also awarded SMTA’s Founder’s Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.
Ryan Mayberry is a Technical Support Engineer based at Indium Corporation’s global headquarters in Clinton, N.Y. He is responsible for providing technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers. Prior to joining Indium Corporation in 2021, Mayberry was an R&D scientist for a global metallization paste business, where he developed novel glass and paste metallization compositions tailored for emerging technologies. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.
BANNOCKBURN, IL — IPC recently convened a roundtable of electronics executives to discuss trends driving the industry’s migration to the factory of the future. The executives came to a shared conclusion that the transition to the factory of the future features many challenges and pitfalls but making the transition will be increasingly critical to any company seeking to compete in the global economy. A summary of the discussion is now available: “The Evolution of Factories of the Future: What You Need to Know.”
In reaching their conclusion, the roundtable participants discussed common barriers in adopting smart manufacturing technologies and skill disparities in the electronics manufacturing workforce. They also shared practices they believed to be important as companies work to increase digitization and enhance manufacturing operations. Among other topics, company leaders talked about creating a workplace culture that embraces change and innovation.
“Executives agreed that despite the challenges in transitioning to the factory of the future, they have recognized the value in doing so and are now looking to integrate solutions that will deliver measurable benefits to their company,” said Matt Kelly, IPC chief technologist.
To view report, visit www.ipc.org/F2report. IPC offers additional resources to assist and guide the electronics manufacturing industry through the next industrial revolution. For more information, visit www.ipc.org/solutions/ipc-factory-future or www.ipc.org/advocacy/industry-intelligence
SAN FRANCISCO — Tempo Automation Holdings, Inc. (Nasdaq: TMPO) (“Tempo Automation” or “Tempo”) announced today that Blur Product Development (“Blur”), a leading medical device design and development partner, has elected to leverage Tempo’s Accelerated Electronics Manufacturing Platform to speed up product development timelines for its clients.
Recognizing that delays can result in significant costs to their clients as a result of extra work and delayed or lost revenues, the team at Blur has opted to rely on Tempo’s first-time-right printed circuit board assemblies (“PCBAs”). The Tempo platform supports Blur’s acceleration efforts through prototyping and into production, ultimately bringing clients’ projects to market more quickly.
Blur recently ran the same 50-board project through both Tempo and another PCBA vendor that promised quick turn times. While both manufacturers were able to deliver boards quickly, Tempo’s quality stood out.
“With the other vendor, who was lower priced, we had almost 50% fallout on 50 circuit boards,” said Jeff Rosino, Partner at Blur. “We had 0% fallout when running the same order through Tempo.”
With exceptionally high acceptance rates and fast shipments, it is an easy decision to continue to partner with Tempo. “Tempo’s quality paired with speed blows us away,” said Rosino.
Additionally, Blur looks for flexibility in its partners, which comes down to the ability to make changes quickly. “We value Tempo’s ability to adapt purchase orders to meet changing needs, especially given current component availability constraints,” said Rosino.
Joy Weiss, CEO of Tempo Automation, said, “Tempo has focused its manufacturing platform to serve the unique needs of early stage electronic product development. Like Blur, our goal is to help get our customers’ products to market as quickly as possible.”
OSAKA — Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Nihon Superior’s TempSave™ series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.
High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, a high speed jetting paste version is available, TempSave B37 P611 which provides consistent dot sizes.
LF-C2 P608 is a completely halogen free, lead-free, low voiding solder paste. The demand of the automotive industry for solder alloys that deliver long life in conditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deformation that drives failure in thermal cycling, the trade-off is that their hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, delivering long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.
SN100CV ® P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver- containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag 3 Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305.
The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 P608 both deliver excellent performance over a wide range of component types and process parameters.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english
LAKEVILLE, MN – ITW EAE will be showcasing its latest developments at IPC APEX, January 24-26 in San Diego. The ITW EAE booth #1106 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This new and innovative system reduces wet out areas and improves capillary flow for underfill and provides access to dispense on side walls, underneath, or around tall components.
Camalot will also feature a new syringe cooling option that increases the “pot-life” of underfill materials by maintaining the syringe at controlled temperature within the heated machine environment. This innovative solution reduces material waste, reduces downtime, and increases process stability. Depending on the material properties and internal machine temperature, underfill material will last 3-5 times longer when using the syringe cooling system.
Electrovert will demonstrate the new Auto Adjust Exit Wing that is being introduced for its wave soldering machines. It automatically adjusts laminar wave flow to match board velocity for reduced defects. The Auto Exit Wing provides highly repeatable, precisely controlled exit wing adjustment that has been proven to deliver up to a 70% reduction in bridging defects and improved topside hole fill. Adjustments are made on-the-fly, eliminating the need for skilled labor to adjust the exit wing manually during product changeover.
MPM will conduct live demonstrations on the Momentum II Elite printer. This proven, highly-productive printer features enhanced technologies that provide further improvement in machine productivity, yield, ease of use, and flexibility.
Vitronics Soltec will feature the ZEVAm+ Selective Soldering solution with the patented Bridge Prevention Technology integrated with the n2 cone. The nozzle is 3D printed out of stainless steel and is then hard chromized for an infinitely long service life.
Vitronics Soltec will also showcase the Centurion™ Reflow Oven with True N2 to Air Switching. This is an option that no one else offers. With the push of a button you can automatically switch between true air environment and true nitrogen environment.
