CRANSTON, RI – Federal Electronics, a leader in providing advanced electronic manufacturing services, is pleased to announce that its Cranston facility has successfully achieved recertification to ISO 13485. Federal Electronics continues to help life science and medical equipment manufacturers navigate the challenges of complex, competitive markets by offering cost-effective, high- mix, and low-to-medium volume production solutions.
ISO 13485 is an internationally recognized quality management system standard for medical device manufacturers, ensuring that organizations can consistently meet regulatory and customer requirements for safety, quality, and performance. This recertification demonstrates Federal Electronics’ ability to manufacture complex medical electronics systems in a controlled environment while maintaining stringent process controls.
“We take pride in providing best-in-class medical electronics manufacturing solutions, ensuring supply chain confidence and uncompromising quality control,” said Ed Evangelista, President, Federal Electronics. “Our commitment remains steadfast in supporting life science and medical equipment manufacturers with cost-effective, high-quality, and scalable solutions”
With strategic US-Mexico manufacturing operations, the company provides customers with unprecedented cost reductions while maintaining superior quality and compliance. Operating under an umbrella of ISO 9001, AS9100, and ISO 13485, Federal Electronics’ Quality Management System ensures that the company applies a disciplined approach to every facet of the company.
This includes the development of manufacturing, test, and inspection processes; control of non- conforming raw material, WIP, and finished product; supplier management; material and capacity resource planning; employee training and certification; and a robust corrective and preventative action system.
For more information on Federal Electronics and its capabilities, visit www.federalelec.com or contact sales@federalelec.com
NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 3-6 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ. The KYZEN clean team will be on-site at Booth #705 providing information about multi- process power module cleaner MICRONOX MX2123 during the event.
With the continued rise in demand for high- performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
The IMAPS Device Packaging Conference is an annual, international event celebrating its 21 st year serving as a forum for the exchanging of knowledge while providing technical, social and networking opportunities for leading scientists, process engineers, product engineers, manufacturing engineers, academia and business managers in addition to sales and marketing professionals.
For more information regarding these products and the full line of MICRONOX products, visit www.kyzen.com
TORONTO, ON – Continuing the expansion of its global footprint, Bittele Electronics brought on line the newest addition to its global production capacity: three assembly lines located in Malaysia.
Consistent with its policy of remaining competitive in face of changing global trade conditions, Bittele is proud to now be able to offer US Clients specifically, a manufacturing option unaffected by tariffs recently announced on goods and services originating from Canada and China.
Bittele boards assembled in Malaysia follow the same strict quality standards our clients are accustomed to, and cater to the same client needs - from prototypes to low and mid- volume production. They are subject to the same quality control procedures and oversight that Bittele clients have come to expect - from Automated Optical Inspection (AOI) to X-ray inspection for BGA and QFN components, to functional testing, and in- circuit testing (ICT).
"We are excited to announce to our valued client base that we just expanded our global presence to Malaysia. This move allows us to better serve our US clients with high- quality PCB assembly solutions while remaining price-competitive in spite of tariffs," said Ben Yang, CEO of Bittele Electronics.
WOOSTER, OH – RBB, a trusted leader in electronics manufacturing since 1973, is proud to showcase its advanced through-hole assembly capabilities, a key part of its specialized and flexible production offerings. RBB has invested in state-of-the-art equipment and automation to meet the specialized needs of its customers.
RBB uses a range of cutting-edge automated insertion, soldering, and cleaning equipment, ensuring precision, consistency, and efficiency in every project. The company’s robust through-hole assembly line includes:
RBB is known for its high-mix, low-to-mid volume production expertise, providing customized through- hole solutions for industries requiring robust, long-lasting electronics. Whether for legacy systems, industrial controls, or mission-critical applications, RBB’s team combines automation with skilled craftsmanship to deliver exceptional quality and reliability.
“At RBB, we’ve built a highly capable and efficient production line to support our customers’ needs,” said Bruce Hendrick, CEO and Owner of RBB. “By leveraging advanced automation while maintaining flexibility in manufacturing, we ensure our clients receive superior products.”
To learn more about RBB’s custom industrial control panels and PCB integration, visit www.rbbsystems.com
TILBURG, NETHERLANDS – Mek (Marantz Electronics), a global leader in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) systems, is excited to announce its participation in IPC APEX EXPO 2025, the largest electronics manufacturing event in North America. Taking place from March 18-20, 2025, at the Anaheim Convention Center, Mek will be exhibiting at Stand 1632, where visitors can explore the company’s latest AOI innovations, including the new PowerSpector JSAz 550 desktop AOI and the VeriSpector Assembly Station AOI, along with its recently launched ROI Calculator.
The new Mek PowerSpector JSAz 550 desktop AOI system features a completely redesigned chassis, including upgraded motors, drives, and spindles. While the optics and software remain consistent with MEK’s other desktop models, the new chassis design ensures that the JSAz 550 meets the demands of inspecting larger PCBs with efficiency and precision.
The latest release retains the ultimate flexibility of other Mek PowerSpector desktop AOI systems, known for high defect coverage and short programming times. PowerSpector remains the only desktop AOI solution on the market that can be equipped with nine cameras, offering unmatched inspection precision for manufacturers with space constraints. It is equipped with selective 3D laser measurement technology for precise height measurements and offers a versatile inspection engine capable of handling SMT and THT components.
In addition, Mek will highlight its VeriSpector AOI system, specifically designed for the inspection of Through-Hole Technology (THT) components before they enter wave or selective soldering processes. With inspection times of under five seconds, VeriSpector enables manufacturers to perform real-time assembly and placement checks, allowing for immediate repairs and defect prevention. The inline version of VeriSpector, which will be on display, ensures robust performance and compatibility with a range of automation options, making it a vital tool for enhancing the quality and efficiency of manual and semi-automatic assembly processes.
Mek will also present its new ROI Calculator, a powerful online tool that helps manufacturers assess the financial benefits of AOI investment. By entering key production data, such as operator wages, PCB output, and batch sizes, users can instantly calculate potential cost savings and return on investment. With full transparency, the tool allows manufacturers to see the true economic impact of transitioning from manual to automated inspection.
Visitors to Stand 1632 at IPC APEX will have the opportunity to see Mek’s advanced AOI systems in action and discover the tools they need to enhance inspection accuracy, reduce costs, and drive efficiency.
To secure your place, register now at https://www.ipcapexexpo.org/2025-registration-options
HOFFMAN ESTATES, IL – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is set to unveil its groundbreaking 3Di-EX Series to the American market at the 2025 IPC APEX EXPO, taking place March 18-20, 2025 at the Anaheim Convention Center, USA.
Visitors to Booth 2420 will get an exclusive look at this innovative solution that redefines inspection technology with cutting-edge AI capabilities and a unique upgradable hardware design.
The 3Di-EX Series introduces a new era in inspection systems, leveraging upgradable hardware to allow users to replace optical units without overhauling the entire platform. This future-proof design ensures manufacturers can stay ahead of technological advancements while minimizing costs.
By combining supervised and unsupervised AI learning models with human judgment, the AI approach delivers faster, more precise, and consistent inspections across a variety of assembly types and market sectors.
Engineered for high-density PCBs and multi-level assemblies, the 3DiEX Series features advanced customization options such as Z-axis adjustments, dome lighting, UV lighting, and side cameras. Its interchangeable camera resolutions and AI- powered inspection tools enable users to meet diverse and evolving inspection challenges with accuracy and reliability.
The AI-powered platform of the 3Di-EX Series accelerates image analysis, defect detection, and inspection programming, reducing cycle times and maximizing throughput. This speed, combined with advanced M2M communication and high-speed software features, makes the 3Di-EX Series a game-changing solution for modern manufacturing environments.
"The 3Di-EX Series represents the future of inspection technology," said Craig Brown, General Manager of Saki America. "By combining advanced AI, modular design, and seamless integration, we’re empowering manufacturers to meet the challenges of today’s complex production environments with unmatched efficiency and reliability."
Visit Saki at Booth 2420
Attendees are encouraged to visit Booth 2420 during IPC APEX EXPO 2025 to see live demonstrations of the 3Di-EX Series and learn how Saki’s state-of-the-art solutions can transform their inspection processes.
For more information about the 3Si/3Di-EX Series, please visit www.sakicorp.com/en/