Lakeville, Minnesota, March 4, 2025 – ITW EAE, a leading manufacturer of high-performance equipment for the electronics assembly and thermal processing industries, is pleased to announce the promotion of Joy McKnight to Vice President and General Manager. In this role, Joy will oversee ITW EAE’s operations and strategic direction, leading its well-established brands, including Camalot, Electrovert, MPM, Vitronics Soltec and Despatch.

Joy brings extensive industry experience in product management, operations, and business leadership. She joined ITW in 2014 as Director of Product Management at Despatch. Following the formation of ITW EAE in 2016, she took on a broader role leading Global Parts, Service, and Support. In 2021, Joy was promoted to Business Manager for the EA Equipment segment, where she played a critical role in global engineering, operations, and sales.

As VP/GM, Joy will focus on advancing ITW EAE’s market position, strengthening customer relationships, and leading key initiatives to enhance operational efficiency and technology leadership.

For more information about ITW EAE, visit www.itweae.com

As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup of high-reliability products at APEC 2025, taking place March 16-20, in Atlanta, Georgia.

With a strong focus on power device packaging, Indium Corporation provides advanced material solutions engineered to enhance energy efficiency, optimize thermal management, and support long-term sustainability in electrification applications. A key part of this innovation is Indium Corporation’s Fluxless Assembly Solder Technology (FAST), which enables high-reliability, flux-free soldering solutions tailored for next-generation power electronics.

Indium Corporation will showcase the following among its featured products:

• Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.

• InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.

• Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.

• Indalloy®276 is a unique lead-free solder alloy that offers a wide service temperature capability and improved reliability up to 175°C. It has demonstrated high-reliability performance while also being capable at both moderate and high service temperature conditions

• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.

• Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.

• QuickSinter® is a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE™ range of pressure sinter pastes:

o InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE™29 features high workability, making it suitable for printing or dispensing applications.

o InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCE™MF is specially formulated for printing applications, providing low process yield loss due to print defects.

o InFORCE™ LA – a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.

To learn more about Indium Corporation’s power electronics and solder solutions, visit www.indium.com or visit our experts at APEC at booth #404.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.

San Diego — March 2025 —— KIC, the leader in smart thermal process technologies for electronics manufacturing, will exhibit at the SMTA Dallas Expo & Tech Forum on Tuesday, April 1, 2025 at the Plano Event Center in Plano, Texas. Attendees will have the opportunity to experience KIC’s latest innovation, the Thermal Analysis System (TAS) Software, designed to revolutionize thermal profiling and process optimization.

The TAS Software is a major advancement in thermal management, addressing emerging industry challenges while unlocking new opportunities for electronics manufacturers. Featuring a modern, intuitive interface and AI-powered insights, the software streamlines process control, allowing manufacturers to optimize thermal profiles with minimal effort. This cutting-edge solution enhances efficiency and consistency across production lines, making it a game changer for today’s demanding electronics manufacturing environments.

One of the most notable features of TAS Software is KIC’s award-winning Common Recipe Finder, which automates the selection of optimized thermal recipes, ensuring peak performance and repeatability. “From AI-enhanced functionality to a radically improved user experience, the TAS Software is built to set a new standard in thermal analysis,” said Miles Moreau, General Manager at KIC. “By developing this platform to tackle real-world production challenges, we are giving manufacturers the tools they need to achieve superior process control and efficiency.”

For more information about KIC and the TAS Software, stop by the KIC booth at the SMTA Dallas Expo & Tech Forum or visit https://kicthermal.com.

About: KIC is a leading provider of thermal profiling and process control solutions. With a commitment to innovation and quality, KIC delivers cutting-edge technologies that help manufacturers enhance production efficiency, product quality, and sustainability. KIC-Making Ovens Smarter

Cincinnati, OH – March 3, 2025 - KOKI Americas is pleased to announce the appointment of Greg Starrett as National Sales Manager. With over 30 years of experience in the electronics manufacturing industry, Greg has a proven track record of driving business growth, leading operations, and facilitating large-scale deals. His deep industry knowledge and strategic approach make him a valuable asset to KOKI and its customers.

Greg’s expertise spans sales, operations, and manufacturing, enabling him to anticipate and address the evolving needs of electronics manufacturers. His leadership will strengthen customer relationships and enhance KOKI’s ability to deliver high-quality soldering solutions across North America.

"Greg’s experience and industry insight align perfectly with KOKI’s commitment to innovation and customer success," said Shantanu Joshi, Head of Customer Solutions and Operational Excellence. "His leadership will be instrumental in expanding our market presence and delivering exceptional value to our customers."

Greg joins KOKI under the leadership of Shantanu Joshi, who was recently promoted to Head of Customer Solutions and Operational Excellence. Shantanu brings extensive expertise in R&D, process optimization, and reliability engineering and will focus on advancing KOKI’s business growth in North America.

For more information about KOKI and our industry-leading solutions, visit koki-global.com.

About Koki

Founded in 1964, KOKI leads in advanced soldering materials, emphasizing innovation, sustainability, and compliance. From halogen-free fluxes to low-melting-point alloys, our solutions reflect a dedication to quality and environmental responsibility. Beyond products, KOKI provides comprehensive technical support, including analytical services and process optimization, to ensure optimal performance.