PEORIA, AZ - HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce its selection as one of only 25 companies nationwide to participate in the highly competitive Blackstone LaunchPad Summer 2025 Internship Program. Through this program, HyRel Technologies has secured one of 40 available internships, providing a valuable opportunity for students to gain hands-on experience in the industry.

Blackstone LaunchPad is a nationally recognized initiative designed to connect students with high-growth companies, fostering career development and innovation. The program is open exclusively to students from Arizona State University (ASU) and Maricopa County Community College District (MCCCD).

“We are honored to be part of such a prestigious program,” said Brian Watson, Founder at HyRel Technologies. “This internship represents a unique opportunity for students to gain real-world experience in advanced manufacturing and technology while contributing to cutting-edge projects at HyRel.”

How to Apply

Students interested in applying must first join the Blackstone LaunchPad WorldLabs group to ensure proper data tracking and program eligibility. They can then search for HyRel Technologies within the platform to locate available internship positions. For more information and to apply, visit: Blackstone LaunchPad Internships .

HyRel is dedicated to not only advancing its business but also to fostering the growth and potential of individuals who will shape the future of the semiconductor industry. For more information about HyRel’s innovative internship program and its dedication to community engagement, visit www.HyRel.tech .

About HyRel Technologies

HyRel is a worldwide provider of high quality, quick turn semiconductor modification solutions serving the military, space, automotive, energy and commercial markets to companies seeking to improve product reliability. HyRel provides robotic hot solder component tinning, component solder ball removal and replacement, component tape and reel packaging services and component bake and dry pack services to customers worldwide. HyRel is also developing proprietary micorobotic innovations to elevate the speed, reliability, and safety of standard semiconductor processes. For more information about HyRel Technologies, please visit www.HyRel.tech.

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce an exclusive webinar, Solder Reflow Oven Fundamentals and Thermal Profiling Approaches, hosted by E-Tronix, BTU’s representative. This in-depth session, presented by Bob Bouchard, will equip SMT engineers, process managers, and production supervisors with the knowledge and tools to optimize their reflow processes for maximum yield and reliability.

Scheduled to take place Thursday, April 17th, from 1-2 p.m. CST, this webinar will cover key aspects of reflow oven technology, including:

• Heating methods and atmosphere control
• Hardware configurations and thermal profiling
• Aligning profiles with solder paste specifications
• Process monitoring and troubleshooting strategies

Participants will gain valuable insights into fine-tuning thermal profiles, leveraging process monitoring tools, and addressing common challenges in PCB manufacturing. By attending, industry professionals will walk away with practical techniques to enhance soldering quality, improve process consistency, and reduce defects.

Don’t miss this opportunity to elevate your reflow soldering expertise!

Register now: https://meet.zoho.com/qAeP-C9f-NmC

For more information about BTU International and its industry-leading reflow solutions, visit www.btu.com.

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

ANN ARBOR, MI - Aven proudly announces that Tom Jura and Jon Moore of Z TECH SERVICES, INC. have achieved the Sales Buster Goal Award for 12 consecutive months — a first in the company’s history. This remarkable accomplishment is a result of their exceptional dedication and sales performance.​

Aven’s Sales Buster program, in place for nearly a decade, sets ambitious monthly sales targets for field representatives, rewarding those who meet these goals with commission bonuses. Achieving this award for an entire year without interruption is unprecedented, highlighting the outstanding efforts of Jura and Moore.​

Z TECH was established in 1993 and serves Illinois, Kentucky, Indiana, Michigan, Wisconsin, Iowa, Missouri, Kansas, and Nebraska with a sales
staff that combines experience and technical ability to provide clients with an efficient and effective sales call.

Z TECH represents Aven’s product line, featuring over 750 tools for optical inspection and precision assembly. Their offerings include stationary and portable microscopes, video inspection systems, high-resolution digital and video cameras, lenses, illuminated magnifiers, software for image analysis, and various precision assembly tools.

For more information, visit www.aventools.com.

About Aven

Aven is a solutions provider for binocular & trinocular stereo zoom microscope systems; digital microscope systems, numerous led magnifier lights, and a wide variety of precision hand tools used for micro-assembly. Aven’s key customer markets are in the electronic assembly, military/ aerospace & defense, medical device manufacturing and more.

DALLAS, TX – The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has for years organized special events for students. This year, given the urgent need for workforce development in this globally critical industry, the ECTC conference has made student engagement and involvement a major focus.

More than 2,000 scientists, engineers and businesspeople from more than 20 countries are expected to attend the 75th annual ECTC, which will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas, along with 135+ exhibitors.

In celebration of the 75th anniversary of this great conference, the ECTC Executive Committee is announcing three new initiatives to complement our existing student-focused offerings. They are a Local Student Engagement Program, a Student Volunteer Service Program, and a Student Competition. They aim to inspire students, enhance their participation, foster engagement, and provide valuable learning opportunities in the fascinating and fast-growing field of microelectronics packaging.

The three new student initiatives are:

• Local Student Engagement Program: On Wednesday, May 28, this program will bring ~25 students and their teachers and professors from local high schools/community colleges to the conference, offering a unique opportunity for young students to interact with industry professionals and gain insights into the electronics packaging and semiconductor manufacturing industries. ECTC will provide complimentary transportation and one-day registration to all participants. The agenda includes breakfast with ECTC Executive Committee members; attendance to the keynote presentation and an exclusive Q&A session with the keynote speaker; a guided tour of the Exhibit Hall and individual meetings with industry participants there; participation in the Wednesday morning Interactive Presentations session and discussions with the paper presenters; a luncheon with ECTC Technical Committee members; and a closing Q&A session with ECTC Executive Committee members. All participants will receive a certificate of attendance and a gift from the ECTC conference.
• Student Volunteer Service Program: This will enlist ECTC student attendees who have already chosen the electronic packaging industry as their career path to build and expand their professional network through working with ECTC Technical Committee members. Participating students will be assigned to technical sessions and will help the session chairs with session-related duties. The activities include breakfast with the session chairs, counting the attendees during the session for each talk, and collecting scoring sheets at the end of the session. The students will receive a certificate of appreciation from ECTC for their service.
• Student Competition: In this previously announced competition, students will describe their innovative solutions to enhance the thermal performance and reliability of high-temperature microelectronic components and systems in five key technical areas:
  • Predictive Modeling and Mitigation of Warpage in Optical MEMS Bare Die Integration on PCB or Flex Substrate
  • Modeling CTE Mismatch Effects in Multi-Material Packages
  • Reducing Thermal Resistance and Improving Reliability in High-Temperature Power Electronics Modules
  • Addressing Thermal-Mechanical Challenges in Heterogeneously Integrated Opto-Electronic Packages
  • Developing a Condition Monitoring Concept for Electronic Components or Systems
  • The winning three teams will present their work at the Student & Start-up Innovation Challenge on Wednesday, May 28 from 6:30–8:30 p.m. to an international audience of industry leaders, researchers, and academics.

ECTC 2025 offers other opportunities to students as well:

• Student Reception: On Tuesday, May 27 from 5-6 p.m., Texas Instruments will host a student reception during which students attending the conference can engage with members of the ECTC Executive Committee and top leaders from industry, research, and academia to explore the latest trends in microelectronics technology.
• Student Interactive Presentation (IP) session: On Friday, May 30 from 10 a.m. to noon, students whose papers have been accepted will present their research during this dedicated session, enabling them to receive direct feedback from industry and academic leaders on their work.
• Awards: ECTC recognizes students’ contributions to microelectronics packaging research through several prestigious awards. Intel sponsors the Intel Best Student Paper Award and the Intel Outstanding Student Paper Award to honor exceptional student research. Texas Instruments awards the TI Best IP Student Paper Award to the top student in the IP session.
• ECTC Student Travel Award: To encourage student participation, the IEEE Electronics Packaging Society which sponsors the ECTC conference offers the ECTC Student Travel Award, providing 15 students with a certificate and reimbursement for travel expenses (up to a specified limit).

Follow ECTC on social media

Flickr: https://www.flickr.com/photos/38916807@N07/albums/
LinkedIn: https://www.linkedin.com/groups/1916290/

About ECTC, EPS & IEEE

The ECTC technical program addresses new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies relevant to electronics packaging.

The IEEE’s Electronics Packaging Society (EPS) sponsors ECTC. EPS is the leading international forum for scientists and engineers engaged in research, design and development of revolutionary advances in microsystems packaging and manufacturing. It encompasses all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components.

IEEE is the world’s largest technical professional organization and a public charity dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers, and telecommunications, to biomedical engineering, electric power, and consumer electronics.