Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.

The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.

An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.

TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.

The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.

TERRELL, TX – Conecsus LLC announces that the company is producing metals products for sale including Grade A Sn Ingots and/or short pour T-blocks, SnSb Low Pb (<0.35 and <0.2 Pb, Sb 1.5-4%, Balance Sn) in short pour blocks, SnSbPb (Sb 1-6%, Pb <1.5, Balance Sn) and Bullet Pb 2/6/92 Tribar (marketed as Conecsus TB26).

“Conesus has made a significant investment to make these products”, states Steven J. Butler, Commercial Director, who is the contact for all sales. Photos and specifications of the products are available. Contact Steve at sbutler@conecsusllc.com or Laurie Debord at (972) 551-5900.

Conecsus LLC, based in Terrell, Texas, USA is an ISO 14001 EMS certified metals recycling company and refiner. Conecsus purchases metal wastes from its customers containing primarily Tin, Lead, Silver, and Antimony, and converts them into usable metal products for sale back into the marketplace.

MIDDLETOWN, PA – Phoenix Contact USA and Waldom Electronics Corporation have partnered on a new program that will result in less inventory finding its way to a landfill. The program supports Phoenix Contact’s goal of a carbon-neutral value chain by 2030.

Under the agreement, Phoenix Contact authorized distributors can send non-moving inventory to Waldom for possible resale. Waldom will manage this inventory and can resell the stock to other authorized distributors. The agreement also authorizes Waldom to designate a percentage of sales to fund environmental and plant-a-tree programs.

“By partnering with Waldom, we’re giving our distributors a more sustainable way to manage their inventory,” said Chris Beevers, Director – Electric Channel Management, Phoenix Contact USA. “This partnership is a perfect example of the Phoenix Contact Purpose Statement in action: Together, we are creating a sustainable world based on our passion for technology and innovation.”

“We’re proud to partner with Phoenix Contact — a company that shares our deep commitment to sustainability,” said Don Akery, CEO of Waldom Electronics. “Together, we’re creating more responsible ways to manage slow-moving and excess inventory, advance circularity, and support environmental initiatives like tree planting. Partnerships like this turn shared values into meaningful impact."

DOVER, DE – Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, has launched its Ambassador Program in the United States. The initiative is designed to grow Luminovo’s North American presence by tapping into industry professionals who want to share its solutions with their networks and earn referral commissions in return.

The program is aimed at supply chain consultants, electronics and manufacturing experts, and professionals with strong networks in the EMS, OEM, and contract manufacturing space. By referring new business to Luminovo, Ambassadors can earn up to 20% commission on the first year’s contract value for each successful referral. In addition to earnings potential, Ambassadors receive access to helpful materials, an official partner badge, and a dedicated point of contact at Luminovo.

“With this program, a partner can earn tens of thousands of dollars by referring new EMS and CM business to us,” said Sam Mason, business & operations lead – North America at Luminovo. “It’s also a great way for professionals across the electronics supply chain to connect others to tools that truly modernize quoting and procurement.”

Trusted by more than 200 electronics companies globally, Luminovo helps OEMs, EMS providers, and PCB suppliers digitize quoting workflows, centralize data, and reduce manual work. With growing adoption in North America, Luminovo is focused on building strong relationships with regional partners who understand the complexities of today’s supply chain and want to help bring modern solutions to market.

Luminovo’s Ambassador Program is structured around a simple, introduction-based model: refer a new customer, and receive a bonus when that referral becomes a paying user.

To learn more or apply to become an Ambassador, visit: www.luminovo.com/ambassador.