Press Releases
CLINTON, NY – Indium Corporation® will feature an array of its innovative thermal management solutions at SEMI-THERM, March 25‒28, in San Jose, CA.
Indium Corporation’s Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporation’s reclaim and recycle program.
The GalliTHERM® portfolio of gallium-based liquid metal solutions draws on Indium Corporation’s more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:
- High thermal conductivity for end-product longevity and reliability
- Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
- Extraordinary wetting ability to both metallic and non-metallic surfaces
Based on the company’s proprietary manufacturing process, Indium Corporation will also be featuring solder thermal interface material (sTIM) for ball grid array (BGA) packages, specifically its indium-silver (InAg) alloys which offer lower voiding compared to pure indium for BGA packages that undergo multiple SAC reflows after the initial TIM-assembly.
To learn more about Indium Corporation’s thermal management solutions, visit our experts at SEMI-THERM.
BOCA RATON, FL – Inovaxe, a leader in delivering ultra-lean SMART production and inventory management solutions to the electronics industry, is excited to announce its partnership with VisiConsult for the third installment of its insightful monthly webinar series. This month, the spotlight shines on the groundbreaking XRHCount Smart Component Counter from VisiConsult's subdivision, VCCount.
Scheduled for Thursday, March 28, 2024, at 10 a.m. Eastern Time, “Optimizing Efficiency with X-Ray Counting,” aims to cater to global participants. Nico Federsel of VisiConsult will lead the session, offering an in-depth look at the capabilities and advantages of the XRHCount Smart Component Counter.
Webinar Highlights:
- Introduction of VisiConsult and the XRHCount Smart Component Counter: Learn about the technology and team behind this revolutionary product.
- Exploring the Benefits of X-ray Counting: The seminar will cover critical aspects such as accurate inventory management, quality assurance, process optimization, and compliance with industry standards.
- Innovations in Automation and Process Improvement: Discover how the new smart barcode reader and software enhancements contribute to faster cycle times, process quality, and increased system efficiency.
Participants will have the unique opportunity to understand how the XRHCount Smart Component Counter integrates with Inovaxe’s ultra-lean SMART solutions, reinforcing the company’s commitment to innovation and efficiency in electronic component management.
Special Features and Options:
- Speed and Convenience: Introduction of the Quad Count Live for immediate detection and automatic tracking.
- Process Quality: Enhanced barcode reading quality and automatic label printing post-reel removal.
- Customization: Choice between a 2.3 MP or an upgraded 5 MP camera for superior convenience and speed.
This seminar is essential for professionals in the electronics industry looking to enhance their inventory and production processes with cutting-edge technology.
To join this pivotal webinar and embark on a journey toward optimizing efficiency in electronics manufacturing, please register HERE.
REDDITCH, UK – Altus Group, a leading supplier of capital equipment for the electronics industry will be exhibiting at the iMPAS-UK MicroTech 2024 conference on April 10th at the Aerospace Bristol Museum. The event, titled "Is Advanced Packaging Ready for Take Off?” will provide a platform for Altus to highlight its cutting-edge solutions for advanced packaging processes and technology within the region's electronics sector.
As both Altus Group and its suppliers closely follow developments in microelectronics and semiconductor packaging, the company is well-positioned to support the growing demand for these technologies in the UK and Ireland. Through its diverse portfolio of equipment and consumables, Altus enables manufacturers to streamline processes such as dispensing, reflow, and inspection – key aspects of the packaging process. This enhances efficiency and ensures quality standards are maintained.
Joe Booth, CEO of Altus Group said: "We are excited to participate in MicroTech 2024 for the first time. This event aligns perfectly with our goal of supporting the advancement of semiconductor capabilities in the region. We look forward to showcasing the latest products from our suppliers and engaging with industry leaders shaping the future of this vital sector."
At the event, Altus Group will exhibit solutions from its prominent global partners, including advanced 3D and x-ray inspection systems, efficient component management, soldering solutions, and consumables for streamlined production. Visitors can explore the company's comprehensive equipment portfolio, tailored to meet the diverse requirements of electronic manufacturing processes.
"The whole world is paying attention to the word 'semiconductor' these days, and the advancements in the semiconductor space regionally have been very interesting to watch," said Joe. "The making of semiconductors has a vast array of processes, but specifically semiconductor packaging processes are a real sweet spot for Altus and our suppliers.
"Our suppliers are actively developing solutions to address manufacturers' needs, while many of our current customers transitioning into Microelectronics are expanding their capabilities to leverage the growing trend of increasing local capacity. I am delighted to contribute to this event, engage with industry stakeholders, and network with key players to gain insights into their challenges. It's essential for us to explore how we can support bringing more opportunities to our shores."
To find out more about Altus’ portfolio of products designed to support advanced packaging processes and technology visit the team at iMPAS-UK MicroTech 2024 conference on April 10th at the Aerospace Bristol Museum.
WALDENBURG, GERMANY – A special kind of educational event was staged in Gran Canaria from February 28 to March 2, 2024. Several teams of students generated innovative solutions and built technological prototypes within a short period of time. These next generation of developers were supported with Würth Elektronik components and expertise.
Where others go on vacation, young talents from various universities hatched innovative solutions for industry in smart farming, smart green energy and mobility, smart automation, IoT, robotics, smart production, smart shipping, and the circular economy.
The Makeathon 2024 focused on practical aspects, in which each team had to come up with a solution to a specific problem and then develop and build a prototype. Over 600 participants formed 24 teams from 29 countries took part in the challenge. The partner companies provided the necessary equipment.
In the seminar “Get the right Voltage: Understand and Setup your Power Supply with Stepdown Converters”, the Makeathon participants were not only provided with the familiar Würth tools, but also with components from the Würth Elektronik eiSos Group, as well as relevant knowledge. The company supported the event with two experienced members of staff.
“The guiding principle of the Makeathon is ‘hands-on’. So of course we’re part of it,” stresses Alexander Gerfer, CTO at Würth Elektronik eiSos. “True to our ‘Creating Together’ mission, we supported this innovative event with expertise and components. Implementation of new ideas takes a reliable partner, so we’re happy to offer our services – as well as to inspire young talents in choosing a career at Würth Elektronik of course. In our efforts to preserve or even improve our living space, everyone has to pitch in. Or putting it in today’s language: Making things happen is like learning – only it takes it to the next level.”
NÁMESTOVO, SLOVAKIA – Incap Slovakia upgraded its second SMT production line, replacing it with advanced SMT machinery. The EUR 891,000 investment increases the factory’s SMT production capacity and supports the planned SMT load increase of more than 45 per cent.
The upgraded SMT line replaces the capacity of two existing SMT lines and has integrated options for automated ERP integration. The total investment of 891,000 EUR in the technology aims to support the expansion of SMT operations and offers the necessary flexibility for handling newly quoted projects.
According to Miroslav Michalik, the Managing Director of Incap Slovakia, this investment has placed Incap Slovakia at the forefront of electronic manufacturing services, ready to capture new business opportunities. “By enhancing our production capabilities, we have not only met but exceeded the evolving demands of our customers, ensuring high-quality, efficient, and flexible manufacturing solutions," explained Michalik.
This upgrade is a key component of Incap Slovakia’s broader technology roadmap, aimed at replacing four existing SMT lines with two new, technologically advanced lines. The benefits of this upgrade are already being realised, including improved SMT operational efficiency, a reduction in the need for skilled technical personnel, enhanced production quality, energy savings, and a stronger appeal to potential customers.
In 2023, Incap Slovakia expanded its Námestovo factory by 1,200 square metres to support increased production demands, boosting its box build production capacity by over 50 per cent. The upgrade involved converting warehouse areas for production purposes and adding a new materials warehouse.
Incap’s factory in Slovakia, based in Námestovo, provides a competitive-cost volume manufacturing option for customers and a dedicated hall for the automotive business. The factory is experienced in electronics manufacturing since 2008, and it has 6,400 square metres of total floor space to serve customers from global companies with operations in Europe. Incap Slovakia provides specialist, niche PCB assembly, complete product build and electromechanical assemblies.
OLDHAM, UK – Solderstar, a leading manufacturer of temperature profiling systems and software for the Electronic Manufacturing sector, is set to showcase its latest innovation at the EPP InnovationsFORUM 2024 in Leinfelden-Echterdingen, Germany on 17th April. Taking centre stage will be the Reflow Shuttle O2 an advanced process verification tool designed to enhance quality control in electronics manufacturing.
The Reflow Shuttle O2 marks a major advancement by integrating real-time oxygen level monitoring in parts per million (ppm) alongside other critical process parameters like vibration, vacuum, temperature profiles, and conveyor speed into one comprehensive platform. This innovative combination provides manufacturers with an unparalleled level of insight and control over their soldering operations.
Chris Williams, Head of European Sales at Solderstar said: "April is an exciting month for Solderstar as we exhibit at two major events - IPC APEX Expo in the U.S. and the EPP InnovationsFORUM in Europe. At both shows, we're pleased to showcase our innovative thermal profiling systems including the new Reflow Shuttle O2.
"The Reflow Shuttle O2 fulfils a critical requirement in advanced manufacturing by providing precise real-time monitoring and control of oxygen levels throughout the reflow process. With its zone isolation technology, it detects fluctuations in oxygen levels, allowing users to optimise nitrogen usage, quickly identify leaks across the entire oven, and consistently achieve superior solder joint integrity. This level of precision is particularly important for high-precision applications. By facilitating detailed monitoring, it enables the detection of problematic oven zones and quantification of nitrogen consumption, thereby facilitating data-driven process refinement."
Complementing its oxygen monitoring capability, the Reflow Shuttle O2 offers a range of advanced measurement modules. Vibration sensing across three axes guides acceptable operating parameters, while dedicated vacuum sensors verify pressure levels down to 10 mbar, calculating critical metrics such as hold times to mitigate component shifts.
High-precision sensors meticulously map the performance of both top and bottom heaters, providing valuable insights into heating uniformity. Positioned at the front of the Shuttle are temperature sensors precisely calibrated for accuracy, offering crucial data on the consistency of heating across the entire width of the heated zone.
Solderstar's latest profiler streamlines verification processes by consolidating various measurement disciplines onto a single, robust shuttle, engineered for seamless integration into any reflow oven. Machine operators benefit from an intuitive interface that simplifies data collection and enables real-time adjustments based on identified process variations.
The EPP InnovationsFORUM 2024 presents the ideal platform to present the benefits of the Reflow Shuttle O2 to electronics manufacturers in Europe. Solderstar's team of experts will be on hand to provide detailed insights, live demonstrations, and answers any technical enquiries.
