CRANSTON, RI — Federal Electronics, a leader in providing advanced electronic manufacturing services, is proud to announce the expansion of its cable assembly and wire harness capabilities at its Cranston, Rhode Island facility. The expanded dedicated production floor space, coupled with the addition of state-of-the-art automated wire processing equipment, enhances Federal Electronics’ ability to serve its customers requiring higher-mix, low- to mid-volume, highly complex cable and harness assemblies.

The Cranston facility now features advanced automated wire processing systems from Artos and Schleuniger, offering significant cost savings, improved throughput, and enhanced quality assurance for customers across military/defense, industrial, and medical sectors. These cutting-edge systems handle a wide range of interconnect assemblies, from high-density harnesses with more than 2,000 connection
points to lengthy cable assemblies exceeding 130 ft.

Unlike traditional high-volume production lines, Federal Electronics’ configurable work cells have been custom-engineered to support lower volume, higher complexity builds, providing a flexible, responsive manufacturing solution for highly regulated industries. Whether building custom wire harnesses for military applications, industrial capital equipment, or advanced medical devices, Federal Electronics delivers superior craftsmanship with consistent quality.

While the Cranston facility serves as the hub for military and defense programs and customers bound by Build America, Buy America Act requirements, Federal Electronics’ Hermosillo, Mexico facility offers a cost-effective alternative for customers seeking value-driven solutions without regulatory constraints. This dual-site approach allows labor-intensive cable assemblies to be built in Mexico and seamlessly integrated into higher-level assemblies in Mexico or at the Cranston site, providing cost savings while maintaining end-to-end quality control.

Federal Electronics’ engineering team plays a critical role in process development, using automation and lean manufacturing principles to optimize labor content, improve first-pass yields, and reduce costs — all while maintaining the flexibility to accommodate higher-mix, lower-volume programs. Operators at both facilities are trained to IPC-A-620 Class 3 standards, ensuring every assembly meets the highest levels of quality and reliability.

To better align with customer production schedules, Federal Electronics offers custom Kanban programs for cable and wire harness assemblies, ensuring components are delivered exactly when needed. This demand-driven approach — supported by synchronized ERP and MRP systems across both locations — allows Federal Electronics to flex capacity within 24 hours, providing unmatched responsiveness for customers with fluctuating demand.

For OEMs seeking a UL-listed partner with the engineering expertise, automated equipment, and flexible US-Mexico manufacturing footprint needed to produce complex, highly engineered cable and wire harness assemblies, Federal Electronics offers a proven, cost-effective solution.

For more information about Federal Electronics and its manufacturing capabilities, visit www.federalelec.com or contact sales@federalelec.com.

About Federal Electronics

Established in 1961, Federal Electronics is a leading provider of advanced Electronics Manufacturing Services (EMS), specializing in complex, mission-critical products for industries such as military/defense, industrial, and medical. With over six decades of experience, the company offers comprehensive solutions that encompass engineering, supply chain management, and manufacturing services tailored to meet the unique challenges of high reliability markets.

ROLLING MEADOWS, IL – BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host a two-day SMT Bootcamp course taught by industry veteran Phil Zarrow. The course is scheduled to take place in Rolling Meadows, IL on May 19-20 with seats available both in-person and online.

Developed by an experienced team of engineers and technicians with diverse backgrounds in electronics PCB manufacturing, this course provides students with insights into the processes, tools, and materials used in modern electronic assembly.

The SMT Bootcamp class emphasizes a practical approach, enabling students to observe the various stages of the SMT assembly process and gain real-world experience from different perspectives and company examples. The course includes lectures and hands-on observations, providing students with a foundational understanding of PCB assembly.

Topics Covered

• PCB Board Fabrication
• Solder Paste Basics
• Stencil Design
• Printing Parameters
• Component Placement
• Overview of the Placement Process - SMT Tour Analysis of the Reflow Process and Profiling
• Wave Soldering
• Testing
• Component ID
• PCB Fabrication Process and Tour
• Stencil Fabrication Tour
• Printing Demonstration
• Solder Paste Printing and Placement Demo
• X-ray Equipment Demo
• Tour of Testing Facility Including ICT and Flying Probe
• Testing and Certification

When: May 19-20 (7:30am – 4:30pm)

Where: 3603 Edison Pl, Rolling Meadows, IL 60008

To register visit: https://soldertraining.net/event-template/?eventtemplate=7-smt-bootcamp

About Phil Zarrow, ITM Consulting

Phil Zarrow bousts over 45 years of involvement in PCB fabrication and assembly, show-casing expertise in equipment manufacturing for through-hole and surface mount technologies. His career spans key roles in companies like Vitronics Corporation, Excellon-Micronetics, and
Universal Instruments Corporation, offering global hands-on experience in setup and troubleshooting of assembly processes.

Since founding ITM Consulting in 1992, Zarrow has assisted clients across diverse areas, including SMT implementation, process failure analysis, quality audits, yield improvement, and equipment evaluation. A sought-after speaker and instructor, he has chaired and instructed at various seminars worldwide, published technical papers, co-authored industry books, and holds patents in PCB fabrication and audit methodologies.

Actively involved in professional associations like IPC and SMTA, Mr. Zarrow has received accolades for his contributions to the industry, including awards from SMTA and recognition for his writings in industry publications. Presently, he produces and co-hosts Circuit Insight’s “BoardTalk” audio program.

About BEST Inc.

BEST Inc. has been a certified IPC Training Center for nearly 30 years offering IPC Certifications for Trainer (CIT) and Operator (CIS) level courses. We offer regularly scheduled class options along with private training classes, customized to your specific needs, across the country. We are committed to providing the highest quality training to meet our customers’ needs and exceed their expectations.

Magnetic materials have become indispensable to various technologies that support our modern society, such as data storage devices, electric motors, and magnetic sensors. High-magnetization ferromagnets are especially important for the development of next-generation spintronics, sensors, and high-density data storage technologies. Among these materials, the iron-cobalt (Fe-Co) alloy is widely used due to its strong magnetic properties. However, there is a limit to how much their performance can be improved, necessitating a new approach.

Some of the earlier studies have shown that epitaxially grown films made up of Fe-Co alloys doped with heavier elements exhibit remarkably high magnetization. Moreover, recent advances in computational techniques, such as the integration of machine learning with ab initio calculations, have significantly accelerated the search for new material compositions. Iridium (Ir)-doped Fe-Co alloy (Fe-Co-Ir) is one such material, identified through machine learning, that has been shown to possess large magnetic moments, representing the strength and orientation of magnetic fields, exceeding even those of conventional Fe-Co alloys. However, identifying the source of these enhanced magnetic properties has been a significant challenge. In particular, the effect of Ir-doping on the magnetic properties of Fe-Co alloys remains poorly understood.

To overcome this challenge, a research team led by Assistant Professor Takahiro Yamazaki from the Department of Material Science and Technology at Tokyo University of Science (TUS) implemented a novel approach. They utilized high-throughput X-ray magnetic circular dichroism (XMCD) on compositionally graded single-crystal thin films. Asst. Prof. Yamazaki explains, “Unlike previous studies which used polycrystalline thin films, we utilized compositionally graded single-crystal Fe-Co-Ir thin films, offering a more controlled environment for probing the mechanisms behind their enhanced magnetic properties. Furthermore, using the world's largest synchrotron radiation facility, SPring-8, we performed XMCD measurements to systematically investigate their magnetic properties.”

The team also included Mr. Takahiro Kawasaki and Prof. Masato Kotsugi from TUS, Dr. Yuma Iwasaki and Dr. Yuya Sakuraba of the National Institute of Materials Science (NIMS), Dr. Naomi Kawamura of the Japan Synchrotron Radiation Research Institute, and Prof. Takuo Ohkochi of the University of Hyogo. Their study was published in the journal Physical Review Materials on March 12, 2025.

Using the advanced technology at NIMS, the team first fabricated compositionally graded thin films in which the amount of Ir doping increased linearly from one end, consisting of pure Fe-Co alloy, to the other end consisting of Fe-Co alloy with 11 at% Ir. The team then performed X-ray magnetic circular dichroism (XMCD) measurements on these films, using both soft and hard X-rays. Soft X-rays have lower energy than hard X-rays and are therefore better suited for studying lighter metals like Fe and Co, while hard X-rays are more suitable for studying heavy metals like Ir. This approach provided a more detailed understanding of each element’s contribution to the material’s magnetic behavior.

The results revealed significant improvements in the magnetic moments of both Fe and Ir due to Ir doping. The magnetic moment of Fe increased by 1.44-fold and Ir by 1.54-fold at 11 at% Ir concentration compared to that at 1 at% Ir concentration. To further validate and understand the origin of these enhancements, the team conducted ab initio calculations. Fe and Co belong to a class of elements known as 3d transition metals, where their outermost electrons occupy the 3d atomic orbitals, while Ir belongs to 5d transition metals.

The theoretical analysis supported the experimental findings and revealed that Ir addition leads to increased electron localization and stronger spin-orbit coupling between 3d electrons of Fe and Co and 5d electrons of Ir. This interaction results in enhanced magnetic moments, primarily through increased contributions of orbital magnetic moments.

“The findings highlight the critical role of Ir in enhancing the magnetic properties of Fe-Co-Ir alloys,” notes Asst. Prof. Yamazaki. “Our efficient, high-throughput materials evaluation workflow and theoretical analysis method will serve as a foundation for designing high-performance ferromagnetic materials. This could lead to the development of highly efficient electric motors and next-generation high-density data storage devices, which could ultimately reduce environmental impact and contribute to a more sustainable society,” he concludes.

Also, Fe-Co alloy with Ir could help in designing efficient electronic devices that can be made commercially available, with essential testing phases. This alloy has potential implementation in developing cost-effective data storage devices.

CONKLIN, NY - Universal Instruments and parent company Delta, a global leader in power and thermal management technologies and a world-class provider of industrial automation solutions, will exhibit on booth 1305 at the 2025 IPC APEX EXPO in Anaheim, CA on March 18–20.

The booth will showcase versatile automation solutions ranging from gantry-based platforms to robotics and software, including Delta’s Digital-Twin (DlATwin) Virtual Machine Development Platform and Universal’s IQ360™ Factory Software Suite. Equipment solutions include Universal’s high-performance Fuzion2-37™ Platform, multi-process Uflex™ Platform, and the value-driven single-process Omni™ Inserter. Delta’s D-Bot robotic solution with plug-and-play setup will also be demonstrated on the booth.

DIATwin Software creates a virtual replica of a machine, using live data to simulate, predict, and optimize performance for smarter decision-making and efficiency. Integrating DIATwin with front-end equipment to create virtual environments helps streamline new product introductions.

The IQ360 Factory Software Suite offers smart factory modules designed to control, monitor, and improve production efficiency. Individual capability bundles include the Design & NPI, Material Management, Production Control, and Monitoring & Analytics modules.

The Fuzion2-37 is a true multi-purpose platform that can be used as a standalone prototyping solution, flexible line balancer, or high-performance multifunction solution.

Uflex accommodates an array of processes, as well as a wide variety of feeding options to perform virtually any automation task. It supports up to four independent process modules, including vacuum or pneumatic placement, screw driving, UV curing, dispensing, and more. The Omni Inserter provides single-process efficiency to complement multi-process cells.

Delta’s D-Bot is a fast, precise, and collaborative robotic solution with a plug-and-play setup, advanced safety features, and rugged durability to enhance automation across various industries. D-Bot features high-precision ±0.02mm accuracy and intuitive 3D software.

“We’re thrilled to offer a greater spectrum of automation solutions and bring new opportunities to our customer base,” said Brad Bennett, Universal Instruments President. “Our objective is to help take our customers’ automation to the next level. Whether automating for the first time, or refining or even reinventing established processes, we have the expertise and portfolio to develop the optimal solution.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.