HARRISBURG, PA – Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to expand its product portfolio with the KerfAid Series, an innovative wafer dicing solution designed to improve cutting performance, reduce defects, and enhance process control.

Through its strategic partnership with The Millice Group, CE3S continues to advance capabilities in precision manufacturing by addressing electrostatic discharge (ESD) challenges early in the dicing process, preventing latent failures that can impact downstream production. KerfAid, when paired with HiSpec injectors, optimizes lubrication, cleaning, and substrate protection, ensuring higher yields and superior quality for semiconductor and electronics manufacturers.

KerfAid is designed to work in tandem with the HiSpec XA1, HiSpec XI, and HiSpec XP injectors, which seamlessly integrate into existing dicing saws, regardless of brand. These advanced injectors provide precise, consistent application of KerfAid, ensuring optimal process control and repeatability. With flexible configurations, each HiSpec injector can support between one and four or more saws, making them adaptable for a wide range of manufacturing operations.

KerfAid ‘000 Series: Maximum Protection & Performance

The KerfAid ‘000 Series, featuring an integrated corrosion inhibitor, is specifically engineered to tackle wafer dicing challenges such as debris build-up, galvanic corrosion, and ESD mitigation. Its high-molecular-weight lubricant enhances blade longevity, extending its lifespan by up to 2X versus DI water and up to 70% compared to leading competitors. Additionally, KerfAid has demonstrated a 90% increase in bond success rate over competitors and reduces chipping and cracking by up to 63% compared to DI water.

Key Benefits:

• Reduces chipping and micro-cracking for precision dicing
• Prevents electrostatic discharge (ESD), minimizing failure risks
• Extends blade life with advanced lubrication technology
• Enhances bond success rates for improved manufacturing yield
• Eliminates debris contamination, ensuring clean, bond-ready surfaces
• Controls corrosion to enhance long-term durability

KerfAid ’00 Series: High-Performance Cleaning Without Corrosion Inhibitor

For applications that require superior lubrication and cleaning but do not require corrosion inhibitors, the KerfAid ’00 Series provides friction reduction and defect prevention with its proprietary triple-surfactant blend. This formula is optimized for LED and IC wafer processing, ensuring superior cooling efficiency and reduced heat-related damage.

Key Benefits:

• Reduces defects, ensuring pristine dicing results
• Enhances blade cooling efficiency, minimizing heat-related damage
• Superior suction capabilities for LED and IC wafers
• Adjustable spring strength, optimizing material handling
• Smooth material release, preventing residue build-up

For more information on KerfAid and HiSpec injectors, or to learn how CE3S supports precision manufacturing, please visit www.ce3s.com or contact sales@ce3s.com 

SEOUL, KOREA – PEMTRON, an inspection equipment developer and supplier, is excited to announce its participation SEMICON China 2025, scheduled to take place March 26-28, 2025 At SNIEC in Shanghai, China. Visitors to Booth E7226 will have the opportunity to explore PEMTRON’s 8800WI, ZEUS, APOLLON and MARS systems.

8800WI Wafer Inspection System: Advanced Imaging for Defect Detection

The 8800WI wafer inspection system incorporates state-of-the-art 2D and 3D imaging technologies to inspect various types of bumps, including micro bumps. Its advanced imaging capabilities enable the system to detect and address quality issues at an early stage of semiconductor manufacturing. The 8800WI ensures that even the smallest defects are identified and corrected, improving yield and product quality.

APOLLON: Comprehensive Package Inspection

For package inspection, the APOLLON system stands out with its ability to handle a wide range of packages, including BGA, LGA, QFN, QFP, CSP, and SOP. Designed for real-time defect detection and automated reporting, APOLLON enhances manufacturing efficiency by promptly identifying and addressing issues. This ensures consistent quality standards throughout the packaging process while minimizing production downtime.

MARS: High-Speed Memory Module Inspection

The MARS system is PEMTRON’s high-speed Automated Visual Inspection (AVI) solution for memory modules. Built for precision and reliability, MARS utilizes advanced image processing technology to deliver accurate inspection results even in challenging environments. With its robust design and exceptional speed, MARS is an essential tool for manufacturers seeking to elevate quality control and production efficiency in memory module assembly.

Visit PEMTRON at SEMICON China 2025

Attendees are encouraged to visit Booth E7226 to experience PEMTRON’s innovative inspection solutions firsthand. Learn how PEMTRON’s advanced systems can transform inspection processes and drive production efficiency in the semiconductor and electronics manufacturing industries.

For more information about PEMTRON and its portfolio of inspection systems, visit www.pemtron.com 

TYNGSBORO, MA – Transition Automation, Inc. (TA) has qualified to supply a top tier Space and Satellite Technology provider’s SMT Printing Process through multiple large-format orders for Permalex Edge Universal Holder and Blade systems with Soft-Touch Paste Retainers.

Through this collaboration spanning the last 12 months, TA has supplied Permalex assemblies for multiple SMT printing platforms including Fuji, MPM-Momentum I, II, and Ersa- VersaPrint. This collaboration highlights a key benefit afforded by Transition’s Universal Holder Design: The ability to standardize Blade and Holder systems across multiple platforms.

“Our industry has bifurcated into many variations of squeegee holder designs, and each requires specific calibration criteria,” states Mark Curtin, President of Transition Automation. “Large multi-site companies often deploy these varying platforms, and it becomes challenging to bring each into conformance with a set of parameters that gravitates to the highest standard of quality. With Transition’s Universal Holder System, each platform has the same squeegee holder design and, therefore, multi-site operations can achieve a more consistent and understandable quality process.”

Another factor that makes this collaboration significant is that the value behind Space and Satellite Technology is usually orders of magnitude higher than traditional SMT and more so for large formfactor production.

“To be qualified for this type of SMT production that launches into orbit is a great achievement and acknowledgement of the good engineering behind Permalex Squeegee technology,” adds Curtin. “Large-format printing has significant cost scale factor where material costs are a squared function. If problems occur they will certainly occur on large- format production more than they will on small formfactors. So having a top-quality squeegee can be a big step toward stability and performance on the SMT line.”

NASHVILLE – Magnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that the company’s President Dr. Mike Bixenman will lead the professional development course “Designing for Reliability: Preventing Leakage Currents and ECM on High-Reliability Assemblies Exposed to Harsh Environmental Conditions” at IPC APEX 2025. The two-part course is scheduled to take place on Monday, March 17, 2025, at the Anaheim Convention Center from 9 AM-12 PM and 1:30-4:30 PM.

Dr. Bixenman will be joined by leading cleaning experts Dr. Adam Klett of KYZEN and Vladimir Sitko of PBT-Works to present the full picture of designing for reliability.

Electronic Hardware is the backbone of emerging and sustainable technologies. Printed circuit board designs are asked to do more, necessitating miniaturization, closer distances between conductors, and smaller bottom-terminated components. The bias distribution and voltages are increasing. Placement of components and thermal management is a critical design factor.

When exposed to harsh environmental conditions, materials and components can affect the device's reliability. Flux residues and the outgassing effects under low-profile components can result in electrical drifts. The moisture characteristics of flux residues, laminates, and polymers can result in transient films that bridge conductors. Each of these conditions can result in leakage currents and electrochemical migration.

Printed circuit board cleanliness and ionic residues increase the need for cleaning. Residues from PCB manufacturing and flux residues from PCBA soldering can be problematic. Selective soldering, manual soldering, and rework can transfer residues to neighboring components. All these factors influence device reliability.

To register and attend this professional development offering and for additional conference information including the program schedule, click here.

To learn more about Magnalytix’s full slate of services, test boards, and real-time reliability solutions, visit www.magnalytix.com