COLUMBUS, OH – SEMICON West will take place in The San Francisco Moscone Center. Its mission is “Building a path forward” by focusing on key challenges affecting the global microelectronics industry such as supply chain disruptions, climate change, and talent shortages. Make sure to visit METTLER TOLEDO’s booth #6348 for a hands-on demonstration of the following products:

• Flash Differential Scanning Calorimeter
• Excellence Level Automatic Balance
• Benchtop pH meter
• UV/VIS Spectrophotometry
• Excellence Level Titrator with Autosampler
• Automated Liquid handler

The event will consist of a variety of seminars including factory automation, latest trends in sensorization, sustainability in electronic materials, creating an inclusive talent pipeline, and more; encouraging the exchange of ideas and within the microelectronics industry.

FUERSTENFELDBRUCK, GERMANY – ARIES Embedded, specialist in embedded services and products, proudly announced that they have joined the STMicroelectronics Partner Program to further enhance service and support for their customers.

“As an ST Authorized Partner, we bundle our knowledge to deliver our expanded technology expertise to our customers,” stated Andreas Widder, Managing Director of ARIES Embedded. “We’re proud to add our embedded knowledge and experience to ST’s products, technologies, and solutions. Our first ST-based module is the OSM-compatible ‘MSMP1’ SiP for applications IoT, medical technology, and industrial systems.” Its core is the STM32MP1 series microprocessor from STMicroelectronics with powerful single or dual Arm CortexA7 cores (up to 800 MHz), combined with a CortexM4 core (up to 209 MHz).

Authorized Partner for Optimized Customer Support

“The ST Partner Program is a high-value offering that has exceeded the expectations of our customers and partners, helping customers’ design teams access strong supplemental skills, tools, and resources that meet design time-to-market challenges across the full ecosystem of products and services while easily integrating ST devices into their projects,” said Alessandro Maloberti, Partner Ecosystem Director, STMicroelectronics. “By selecting, qualifying, and certifying ST Authorized Partners, customers know that the partners they work with have the expertise to accelerate their design and development activities and ensure they ship the most robust and efficient products and services to market.”

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, created the ST Partner Program to speed customer development efforts by identifying and highlighting companies with complementary products and services. Moreover, the program’s certification process assures that all partners are periodically vetted for quality and competence.

Efficient, Versatile and Low Power Module for Industrial

The MSMP1 SiP is compliant with SGET's OSM (Open Standard Module) standard. Almost all functions of the CPU are available on 476 contacts of the small board, measuring only 30 by 45 mm. It features low power consumption, small form factor, and competitive cost. The MSMP1 modules are scalable in terms of performance and memory expansion and can therefore be individually adapted to many project requirements. The system-in-packages supports 512 MB to 4 GB DDR3L RAM, SPI-NOR Flash and 4 to 64 GB eMMC NAND Flash. The numerous interfaces include 10/100/1000 Mbit Ethernet, USB2.0 host/OTG, 2x CAN, UART, I2C, SPI, ADC/DAC, as well as a parallel display interface and camera input. The modules are available in the commercial temperature range, from 0 °C to +70 °C, and in the industrial temperature range, from -40 °C to +85 °C.

CARLSBAD, CA – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China tradeshow, booth E4617. At the booth, you will see these systems:

• The popular ASYMTEK Vantage® fluid dispensing system, Nordson’s most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
• The newest ASYMTEK Forte® fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuit, MEMs, and electromechanical assembly applications. Forte offers real-time skew correction (patented) for better wet dispense accuracy and yield, as well as fast, repeatable setup with automated calibration.
• Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.

Experts will be ready to discuss how Nordson can support your operations for reliable electronic products. SEMICON China will be held at the New International Expo Centre, Shanghai, China, June 29 – July 1, 2023.

SHANGHAI, CHINA – Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.

Delivering compact yet powerful electronic devices The semiconductor advanced packaging industry is at the forefront of meeting the growing demands for highly sophisticated and intricate electronic products utilized in a wide range of applications, including 5G communications, Internet of Things (IoT), augmented reality (AR), smart wearables, electric vehicles, and various consumer and industrial sectors. With a relentless focus on achieving superior performance and compactness, the industry is continuously pushing the boundaries by increasing the component density within semiconductor packages, such as the system-in-package (SiP), while simultaneously reducing the overall package size.

Heraeus Electronics’ solution:

Welco AP520: This state-of-the-art water-soluble type 7 printing paste is designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables, and electric vehicles.

Development of defect-free HPC systems

High-Performance Computing (HPC) has become increasingly integral to everyday life, powering a range of applications including processors for Artificial Intelligence (AI), gaming computers and consoles, 5G smartphones, autonomous driving systems, memory controllers, and more. The key enabling technology for HPC lies in high bump-count and fine bump-pitch flip chips, which require reliable soldering onto substrates. However, the semiconductor industry faces significant challenges in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, and others.

Heraeus Electronics’ solution:

AP500X: This water-soluble, halogen-free tacky flux is specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.

Heraeus’ solution for EMI shielding in 5G technology

Offering accurate selective coating without any masking is the key benefit of the Prexonics® full system solution for EMI shielding on package level. This new technology is the first to enable a thickness aspect ratio of 1:1 at topside and sidewalls and thus only 1.5-2μm conductive film on topside is needed to achieve the required shielding performance. Prexonics® is a unique full system solution offered by Heraeus Printed Electronics, that consists of a special particle-free silver ink, an inkjet printer, and a manufacturing process that uses inkjet printing to apply full, partial or trench coating. This approach allows selective and precise deposition of the silver ink onto specific areas of the component, avoiding excess material and minimizing waste. By using the specialized silver ink customized thin metallization films are possible in the range of 150nm to 4µm.

Finally, Heraeus Electronics will announce its extended product portfolio towards sustainability initiatives with gold bonding wire made with 100% recycled gold and Welco solder paste series made with 100% recycled tin. By incorporating recycled tin or gold into our products, Heraeus Electronics contributes to environmental sustainability, significantly reducing energy consumption and carbon footprint. The pastes formulated with recycled tin maintain the same level of quality as those made with primary tin. Both recycled and non-recycled gold undergo the same meticulous refining process before being transformed into final products, including gold wires and gold-coated silver bonding wires. This ensures the consistent composition & properties across our offerings. Both Heraeus Electronics’ gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and ISO14021:2016.

The Heraeus team also will conduct five live booth presentations that will discuss the company’s newly launched products, and show how its latest materials can further elevate your device performance.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com