Why Is Advanced Semiconductor Packaging Needed?

This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging. The latter highlights the significance of semiconductor technologies in meeting these requirements.

Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements. Wafer level integration provides advantages over traditional methods, such as increased connection density, smaller footprints for size-sensitive applications, and enhanced performance.

"Advanced" semiconductor packaging specifically includes high-density fan-out, 2.5D, and 3D packaging, characterized by a bumping pitch size below 100 µm, enabling at least 10x higher interconnect densities.

Bandwidth Is Key

To enhance bandwidth from a packaging perspective, two key factors come into play: the total number of I/Os (input/output) and the bit rate per each I/O. Increasing the total number of I/Os requires enabling finer line/space (L/S) patterns in each routing layer/redistribution layer (RDL) and having a higher number of routing layers. On the other hand, improving the bit rate per I/O is influenced by the interconnect distance between chiplets and the selection of dielectric materials. These factors directly impact the overall performance and efficiency of the packaging system.

Unleashing High Bandwidth: Exploring Materials and Processing for Advanced Semiconductor Packaging

Delving deeper into achieving higher wiring density and a higher bit rate per I/O from a materials and processing perspective reveals the critical role played by the selection of dielectric materials and the utilization of appropriate processing techniques. These factors have a significant impact on the overall performance and capabilities of the packaging system.

Selecting suitable dielectric materials is crucial, considering properties like low dielectric constant, optimal CTE (as close to the CTE of Cu as possible), and favorable mechanical characteristics that ensure module reliability, such as Young's modulus and elongation. These choices enable higher data rates while preserving signal integrity and facilitating fine line/space features for increased wiring density.

In high-performance accelerators, such as GPUs, inorganic dielectrics like SiO2 have been extensively utilized to achieve ultra-fine line/space (L/S) features. Nevertheless, their use is limited in applications that demand high-speed connectivity due to their high RC delays. As an alternative, organic dielectrics have been proposed for their cost-effectiveness and ability to mitigate RC delays through their low dielectric constant. However, organic dielectrics present challenges, including high CTE, which can negatively impact the device’s reliability, and difficulties in scaling to fine L/S features.

In addition to selecting appropriate materials, the processing techniques employed during packaging fabrication play a crucial role in achieving a higher number of I/Os and improving the bit rate per I/O. The steps involved in 2.5D packaging processes, including lithography, CMP (Chemical Mechanical Planarization), etching processes, and the CMP and bonding processes in 3D Cu-Cu hybrid bonding, present challenges in achieving tighter routing and increased wiring density. IDTechEx provides detailed insights into how the choice of materials influences the fabrication processes, offering a comprehensive understanding of their impact on advanced semiconductor packaging.

Materials and Technologies Covered in the IDTechEx Report

IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report is divided into four main parts, offering a structured approach to understanding advanced semiconductor packaging. The first part provides a comprehensive introduction to the technologies, development trends, key applications, and ecosystem of advanced semiconductor packaging, providing readers with a solid overview. The second part focuses on 2.5D packaging processes, delving into crucial aspects, including dielectric materials for RDL and Microvia, RDL fabrication techniques, and material selection for EMC and MUF. Each sub-section within this part presents a detailed analysis of process flows, technology benchmarks, player evaluations, and future trends, providing readers with comprehensive insights.

The report continues beyond the discussion of 2.5D packaging to the third part, which focuses on the innovative Cu-Cu hybrid bonding technology for 3D die stacking. This section provides valuable insights into the manufacturing process and offers guidance on material selection for optimal outcomes. It also showcases case studies highlighting the successful implementation of Cu-Cu hybrid bonding using both organic and inorganic dielectrics. Additionally, the report includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presented in the last chapter. This forecast encompasses unit and area metrics, providing the industry with meaningful perspectives into anticipated market growth and trends for the next decade.

To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP 

HANOVER, GERMANY – The local Chinese teams of Viscom AG are in the starting blocks for their participation at NEPCON China 2023 in Shanghai. They will present a wide variety of inspection systems for different requirements and inspection gates. An overarching topic that will be in the spotlight at Viscom is artificial intelligence and its contribution to even more efficient quality control.

The electronics industry will come together at the Shanghai World Expo Exhibition & Convention Center from July 19 to 21, 2023, and Viscom China will be participating with booth 1J20. Experts will answer individual questions and be available for technical demonstrations. Great interest is expected in connection with the use of AI – for example, in the verification of inspection results, where decisions can gradually be made by the application itself. Other AI solutions developed at Viscom are, e.g., the X-ray based segmentation of voids and the automated creation of inspection programs. The focus is primarily to relieve the burden on employees at the assembly lines.

The inspection systems on display at the Viscom booth are a perfect example to practically illustrate the complete SMT manufacturing process. The S3088 ultra chrome SPI inspects solder pads quickly and with high precision boasting a height resolution of 0.1 µm/pixel. The system's communication with the printer enables automatic misalignment corrections and optimization of stencil cleaning cycles. The placer, in turn, can use another closed loop to the SPI machine to base the positioning of the components on the actual solder paste alignment. After passing through the reflow oven, the high-throughput S3088 ultra chrome 3D-AOI system takes over the control of soldering and component positions. Nine cameras ensure virtually shadow-free 3D inspection.

What cannot be inspected optically, such as voids in solder joints, is measured and analyzed using state-of-the-art 3D-AXI methods. Depending on the configuration, the award-winning systems of the iX7059 series from Viscom can inspect flat assemblies up to a length of 1600 mm or, e.g., inspection objects weighing up to 40 kg, using X-ray technology. For prototypes, small series, or in case of customer complaints, the X8011-III semi-automatic X-ray system is the perfect solution, which, like the S3088 ultra chrome SPI, will be shown for the first time at an Asian trade show during NEPCON China 2023. Another special highlight: A virtual showroom at the Viscom booth offers an even much larger system overview. Users can move from machine to machine on the screen and call up relevant information.

The manufacturing of the inspection systems is located at the main site of Viscom AG in Hanover, Germany – together with the development of the associated software. An important feature of the ready-to-use applications is, for example, the networked access to results from all inspection gates. The modular vConnect platform, in turn, offers a broad portfolio of innovative and individually scalable digital services ranging from condition monitoring and IT management services to high-performance storage solutions. Real-time data and analyses can be accessed and controlled from devices like a smartphone, tablet, or desktop PC. This makes it possible, for example, to implement cross-site predictive maintenance very efficiently.

PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its participation in NEPCON China 2023 after a four-year hiatus since 2019, at Booth #1H26 in Shanghai World Expo Exhibition & Convention Center, China from 19th to 21st July 2023.

As one of China's largest surface mount technology (SMT) shows, NEPCON China provides the perfect platform for ViTrox to unveil its latest advancements in inspection solutions, ranging from V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE.

The V310i 3D SPI is the key to ensuring SMT product quality, providing effortless programming while achieving excellent repeatability and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. Another great piece of news to share with you is that our SPIs have successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL). Read more about our V310i 3D SPI Solution.

Next in our line-up will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. With A.I. Smart Programming, our AOI can achieve a reduction in human dependency, rapidly improving the programming speed, and guaranteeing quality, accuracy, and consistency during inspections. Therefore, users will enjoy up to 80% programming time reduction, ultimately achieving a higher yield with lower operating costs. Our V510i 3D AOI has also successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification. Read more about our V510i 3D AOI Solution.

The third solution will be our V810i S3 AXI Solution, innovated with an ergonomic design that saves production floor space, while boosting inspection speed by up to 30% with new machine geometry and scanning methods. ViTrox offers a new unique imaging and reconstruction method (H-reconstruction) to address challenging inspections of very heavily shaded components and non-uniformly shaded components. Equipped with A.I. integration, our AXIs have capabilities to detect defects of specific joint types, enhancing inspection accuracy. Plus our AXIs have also achieved IPC-CFX-2591 QPL validation. Explore the groundbreaking V810i S3 AXI Solution today.

We will also be showcasing our award-winning V9i Advanced Robotic Vision (ARV) Solution, revolutionising flexible inspections for conformal coating and final assembly inspections. Featuring a unique 6-axis COBOT design, it enables adjustable angle inspections up to 90°, guaranteeing convenience. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects and checks for screw, cosmetic, connector, and label defects in final assembly without requiring CAD information. Other than that, the solutions provide better traceability in the back-end assembly process compared to human manual inspection. Read more about our V9i ARV Solution’s capabilities in conformal coating inspection and final inspection.

Last but not least, the unveiling of our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions - V-ONE, a Smart Manufacturing necessity that ensures connectivity within the production line, accurate visualisation of data analytics and adept reactivity in Machine-2- Machine (M2M) production. Designed with customisable, flexible drill-down charts and dashboards that optimise production efficiency with insightful real-time information and A.I. prediction, implementing V-ONE allows stakeholders to optimise production through insightful analytics on a real-time basis exceedingly. With V-ONE, anyone can monitor the production status anytime, anywhere. Read more about the unique features available in our V-ONE: A.I. VVTS, ONE View, and Intelligent Control Tower.

Take advantage of this grand opportunity to meet and network with us at NEPCON China 2023! ViTrox’s on-site experts will ensure that all your questions are answered and that you will have a fantastic visitation experience at our booth. Please fill up your preferred appointment schedule via the registration link to meet up with our field experts in person!

For more information, contact us via enquiry@vitrox.com. We hope to see you soon!

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce its participation in the upcoming SMTA Queretaro Expo & Tech Forum, scheduled to take place on July 13, 2023, in Queretaro, Mexico. As a leading provider of environmentally safe maintenance cleaning products, ZESTRON is excited to showcase its cutting-edge solutions and share its expertise with industry professionals.

SMTA Queretaro Expo & Tech Forum brings together industry professionals, engineers, and researchers from the electronics manufacturing field to share knowledge and explore the latest advancements. At booth #202, ZESTRON will showcase its innovative cleaning agents formulated for sustainability and providing efficient and safe cleaning processes, while minimizing the overall environmental impact. By leveraging ZESTRON's expertise, manufacturers can improve operations, reduce environmental impact, and enhance product quality through sustainability.

Don't miss out on this opportunity to enhance your knowledge and learn from the experts. Register HERE.